GPUs

ATI Radeon X1300 HyperMemory vs GIGABYTE GeForce RTX 3050 OC Low Profile 6G Full Specs

4 Shaders
450MHz
2,304 Shaders
1.48GHz
262MB DDR24GB/s
6GB GDDR6168GB/s
··
-
··
6.81 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
30W
TDP
70W

Radeon X1300 HyperMemoryRadeon X1300 HyperMemory-
-
GeForce RTX 3050 OC Low Profile 6GGeForce RTX 3050 OC Low Profile 6G217.8 TOPSINT4 Tensor Sparse
x1

Clock Speed
··
Clock Speed
···
Peak OPS
-
Peak OPS
217.8 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
27.22 TFLOPS
FP16-16 Tensor Sparse
54.45 TFLOPS
Tensor FP16-32
13.61 TFLOPS
FP16-32 Tensor Sparse
27.22 TFLOPS
-
BF16
6.81 TFLOPS
Tensor BF16
13.61 TFLOPS
BF16 Tensor Sparse
27.22 TFLOPS
Tensor TF32
-
Tensor TF32
6.81 TFLOPS
-
FP32
6.81 TFLOPS
-
FP64
106.3 GFLOPS
Tensor INT4
-
Tensor INT4
108.9 TOPS
-
Tensor INT8
54.45 TOPS
Ray
-
Ray
10.26 TOPS
Pixel Rate
1.8 GPixel/s
Pixel Rate
47.3 GPixel/s
Texture Rate
1.8 GTexel/s
Texture Rate
106.3 GTexel/s

Shaders
4 Shaders
Shaders
2,304 Shaders
TMUs
4 TMUs
TMUs
72 TMUs
ROPs
4 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
72 T-Cores
RT Cores
-
RT Cores
18 RT-Cores
Units
-
SMs
18 SMs

Base Clock
-
Base Clock
1.04GHz
Boost Clock
450MHz
Boost Clock
1.48GHz

L2 Cache
-
L2 Cache
2MB shared

262MB DDR2
6GB GDDR6
Memory Bus
64-bit
Memory Bus
96-bit
Memory Speed
500MT/s
Memory Speed
14GT/s
Memory Bandwidth
4GB/s
Memory Bandwidth
168GB/s

TDP
30W
TDP
70W

Multi-Monitor
2
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
2x DisplayPort 1.4
-
2x HDMI 2.1
1x DVI-I Dual-Link
-
1x VGA
-
1x S-Video
-

-
Encoder Model
NVENC 7

-
Decoder Model
NVDEC 5

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
1.8-Slots
-
Height
69 mm (2.72")
Width
181 mm (7.13")
Depth
36 mm (1.42")
Cooling
Blower
1x Fan
Cooling
Open-Air
2x Fans

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2005 branding
Branding
GeForce RTX 2018 branding
Codename
Dali
Codename
NV177
Chip Variant
-
Chip Variant
GA107-140-A1
Market Segment
Desktop
Market Segment
Desktop
Release Date
Oct 5, 2005
Release Date
Feb 2, 2024

Foundry
TSMC
Foundry
Samsung
Fabrication Node
90nm
Fabrication Node
8N
Die Size
100mm²
Die Size
200mm²
Transistor Count
107 Million
Transistor Count
8.7 Billion
Transistor Density
1.07 MTr/mm²
Transistor Density
43.5 MTr/mm²

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