GPUs

GIGABYTE Radeon RX 6700 XT Gaming OC vs Intel Arc A770 16GB Full Specs

2,560 Shaders
2.62GHz
4,096 Shaders
2.4GHz
12GB GDDR6384GB/s
16GB GDDR6560.1GB/s
··
13.42 TFLOPS
··
19.66 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
230W
TDP
225W
Power Connectors
1x 8-Pin
1x 6-Pin
Power Connectors
-

Radeon RX 6700 XT Gaming OCRadeon RX 6700 XT Gaming OC26.85 TFLOPSFP16
x1
Arc A770 16GBArc A770 16GB629.1 TOPSINT4 Tensor
x23.43

Clock Speed
···
Clock Speed
···
Peak OPS
26.85 TFLOPSFP16
Peak OPS
629.1 TOPSINT4 Tensor
-
Tensor FP16-32
157.3 TFLOPS
-
Tensor BF16
157.3 TFLOPS
FP32
13.42 TFLOPS
FP32
19.66 TFLOPS
FP64
839 GFLOPS
FP64
4.92 TFLOPS
Tensor INT4
-
Tensor INT4
629.1 TOPS
-
Tensor INT8
314.6 TOPS
Pixel Rate
167.8 GPixel/s
Pixel Rate
307.2 GPixel/s
Texture Rate
419.5 GTexel/s
Texture Rate
614.4 GTexel/s

Shaders
2,560 Shaders
Shaders
4,096 Shaders
TMUs
160 TMUs
TMUs
256 TMUs
ROPs
64 ROPs
ROPs
128 ROPs
Tensor Cores
-
Tensor Cores
512 T-Cores
RT Cores
40 RT-Cores
RT Cores
32 RT-Cores
CUs
40 CUs
EUs
512 EUs

Base Clock
2.32GHz
Base Clock
2.1GHz
Boost Clock
2.62GHz
Boost Clock
2.4GHz

L2 Cache
3.1MB shared
L2 Cache
8.2MB shared
L3 Cache
96MB shared
L3 Cache
-
L3 Bandwidth
1.25TB/s
L3 Bandwidth
-

12GB GDDR6
16GB GDDR6
Memory Bus
192-bit
Memory Bus
256-bit
Memory Speed
16GT/s
Memory Speed
17.5GT/s
Memory Bandwidth
384GB/s
Memory Bandwidth
560.1GB/s
ECC
No
ECC
No

TDP
230W
TDP
225W
Max Temp
110°C Max
Max Temp
-

Multi-Monitor
4
Multi-Monitor
4
HDCP
HDCP 2.3
HDCP
-

-
3x DisplayPort 2.0
2x DisplayPort 1.4
-
2x HDMI 2.1
1x HDMI 2.1

Encoder Model
VCN 3.0
Encoder Model
Arc

Decoder Model
VCN 3.0
Decoder Model
Arc

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2.4-Slots
PCIe
2-Slots
Height
115 mm (4.53")
Width
281 mm (11.06")
Depth
49 mm (1.93")
Height
98.4 mm (3.87")
Width
279.9 mm (11.02")
Depth
40 mm (1.57")
Cooling
Open-Air
3x Fans
Cooling
Open-Air
2x Fans
Power Connectors
1x 8-Pin, 1x 6-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2020 branding
Branding
Arc branding
Codename
Navy Flounder
Codename
Xe HPG
Chip Variant
Navi 22 XT
Chip Variant
DG2-512
Market Segment
Desktop
Market Segment
Desktop
Release Date
Mar 18, 2021
Release Date
Oct 14, 2022

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N7
Fabrication Node
N6
Die Size
335mm²
Die Size
406mm²
Transistor Count
17.2 Billion
Transistor Count
21.7 Billion
Transistor Density
51.34 MTr/mm²
Transistor Density
53.45 MTr/mm²

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