Intel Arc A770 16GB vs AMD Radeon RX 7700 Full Specs
4,096 Shaders 2.4GHz | 3,072 Shaders 2.4GHz |
16GB GDDR6560.1GB/s | 12GB GDDR6432GB/s |
·· 19.66 TFLOPS | ·· 29.49 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 225W | TDP 200W |
Power Connectors - | Power Connectors 1x 8-Pin |
Arc A770 16GB629.1 TOPSINT4 Tensor
Radeon RX 7700118 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 629.1 TOPSINT4 Tensor | Peak OPS 118 TOPSINT4 Tensor |
Tensor FP16-16 -Tensor FP16-32 157.3 TFLOPS | Tensor FP16-16 29.49 TFLOPSTensor FP16-32 29.49 TFLOPS |
BF16 -Tensor BF16 157.3 TFLOPS | BF16 58.98 TFLOPSTensor BF16 29.49 TFLOPS |
FP32 19.66 TFLOPS | FP32 29.49 TFLOPS |
FP64 4.92 TFLOPS | FP64 921.6 GFLOPS |
Tensor INT4 629.1 TOPS | Tensor INT4 118 TOPS |
Tensor INT8 314.6 TOPS | Tensor INT8 29.49 TOPS |
Pixel Rate 307.2 GPixel/s | Pixel Rate 230.4 GPixel/s |
Texture Rate 614.4 GTexel/s | Texture Rate 460.8 GTexel/s |
Shaders 4,096 Shaders | Shaders 3,072 Shaders |
TMUs 256 TMUs | TMUs 192 TMUs |
ROPs 128 ROPs | ROPs 96 ROPs |
Tensor Cores 512 T-Cores | Tensor Cores 96 T-Cores |
RT Cores 32 RT-Cores | RT Cores 48 RT-Cores |
EUs 512 EUs | CUs 48 CUs |
Base Clock 2.1GHz | Base Clock 1.9GHz |
Boost Clock 2.4GHz | Boost Clock 2.4GHz |
L2 Cache 8.2MB shared | L2 Cache 4.1MB shared |
L3 Cache - | L3 Cache 48MB shared |
L3 Bandwidth - | L3 Bandwidth 1.69TB/s |
16GB GDDR6 | 12GB GDDR6 |
Memory Bus 256-bit | Memory Bus 192-bit |
Memory Speed 17.5GT/s | Memory Speed 18GT/s |
Memory Bandwidth 560.1GB/s | Memory Bandwidth 432GB/s |
TDP 225W | TDP 200W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 3x DisplayPort 2.1 |
3x DisplayPort 2.0 | - |
1x HDMI 2.1 | 1x HDMI 2.1 |
Encoder Model Arc | Encoder Model VCN 4.0 |
Decoder Model Arc | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2.5-Slots |
Height 98.4 mm (3.87")Width 279.9 mm (11.02")Depth 40 mm (1.57") | Height 111 mm (4.37")Width 267 mm (10.51")Depth 50 mm (1.97") |
Cooling Open-Air 2x Fans | Cooling Open-Air 2x Fans |
Power Connectors - | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Xe HPG | Codename Wheat Nas |
Chip Variant DG2-512 | Chip Variant Navi 32 |
Market Segment Desktop | Market Segment Desktop |
Release Date Oct 14, 2022 | Release Date Aug 25, 2023 |
Foundry TSMC | Foundry TSMC |
Other Foundries - | Other Foundries TSMCMCD |
Fabrication Node N6 - | Fabrication Node N5 N6MCD |
Die Size 406mm² - | Die Size 200mm² 113mm²MCD |
Transistor Count 21.7 Billion - | Transistor Count 28.1 Billion 6.2 BillionMCD |
Transistor Density 53.45 MTr/mm² - | Transistor Density 140.5 MTr/mm² 54.67 MTr/mm²MCD |
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