Intel Arc A370M vs NVIDIA GeForce RTX 4060 Laptop 115W Full Specs
1,024 Shaders 1.55GHz | 3,072 Shaders 2.37GHz |
4GB GDDR6112GB/s | 8GB GDDR6256GB/s |
·· 3.17 TFLOPS | ·· 14.56 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 35W | TDP 115W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 101.6 TOPSINT4 Tensor | Peak OPS 466 TOPSINT4 Tensor Sparse |
- | Tensor FP8-16 116.5 TFLOPSFP8-16 Tensor Sparse 233 TFLOPSTensor FP8-32 58.25 TFLOPSFP8-32 Tensor Sparse 116.5 TFLOPS |
Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 25.4 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 58.25 TFLOPSFP16-16 Tensor Sparse 116.5 TFLOPSTensor FP16-32 29.12 TFLOPSFP16-32 Tensor Sparse 58.25 TFLOPS |
BF16 -Tensor BF16 25.4 TFLOPSBF16 Tensor Sparse - | BF16 14.56 TFLOPSTensor BF16 29.12 TFLOPSBF16 Tensor Sparse 58.25 TFLOPS |
Tensor TF32 - | Tensor TF32 14.56 TFLOPS |
FP32 3.17 TFLOPS | FP32 14.56 TFLOPS |
FP64 793.6 GFLOPS | FP64 227.5 GFLOPS |
Tensor INT4 101.6 TOPS | Tensor INT4 233 TOPS |
Tensor INT8 50.79 TOPS | Tensor INT8 116.5 TOPS |
Ray - | Ray 33.66 TOPS |
Pixel Rate 49.6 GPixel/s | Pixel Rate 113.8 GPixel/s |
Texture Rate 99.2 GTexel/s | Texture Rate 227.5 GTexel/s |
Shaders 1,024 Shaders | Shaders 3,072 Shaders |
TMUs 64 TMUs | TMUs 96 TMUs |
ROPs 32 ROPs | ROPs 48 ROPs |
Tensor Cores 128 T-Cores | Tensor Cores 96 T-Cores |
RT Cores 8 RT-Cores | RT Cores 24 RT-Cores |
EUs 128 EUs | SMs 24 SMs |
Base Clock 300MHz | Base Clock 2.29GHz |
Boost Clock 1.55GHz | Boost Clock 2.37GHz |
L2 Cache 4.1MB shared | L2 Cache 32.8MB shared |
4GB GDDR6 | 8GB GDDR6 |
Memory Bus 64-bit | Memory Bus 128-bit |
Memory Speed 14GT/s | Memory Speed 16GT/s |
Memory Bandwidth 112GB/s | Memory Bandwidth 256GB/s |
ECC No | ECC No |
TDP 35W | TDP 115W |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP - | HDCP HDCP 2.3 |
Encoder Model Arc | Encoder Model NVENC 8 |
Decoder Model Arc | Decoder Model NVDEC 5 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename NV187 |
Chip Variant DG2-128 | Chip Variant AD107 |
Market Segment Laptop | Market Segment Laptop |
Release Date Mar 30, 2022 | Release Date Feb 22, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node 4N |
Die Size 157mm² | Die Size 159mm² |
Transistor Count 7.2 Billion | Transistor Count 18.9 Billion |
Transistor Density 45.86 MTr/mm² | Transistor Density 118.9 MTr/mm² |
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