Intel Arc A380 vs AMD Radeon RX 7400 Full Specs
1,024 Shaders 2.45GHz | 1,792 Shaders 1.1GHz |
6GB GDDR6186.1GB/s | 8GB GDDR6172.8GB/s |
·· 5.02 TFLOPS | ·· 7.88 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 75W | TDP 55W |
Power Connectors - | Power Connectors 1x 8-Pin |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 160.6 TOPSINT4 Tensor | Peak OPS 31.54 TOPSINT4 Tensor |
Tensor FP16-16 -Tensor FP16-32 40.14 TFLOPS | Tensor FP16-16 7.88 TFLOPSTensor FP16-32 7.88 TFLOPS |
BF16 -Tensor BF16 40.14 TFLOPS | BF16 15.77 TFLOPSTensor BF16 7.88 TFLOPS |
FP32 5.02 TFLOPS | FP32 7.88 TFLOPS |
FP64 1.25 TFLOPS | FP64 246.4 GFLOPS |
Tensor INT4 160.6 TOPS | Tensor INT4 31.54 TOPS |
Tensor INT8 80.28 TOPS | Tensor INT8 7.88 TOPS |
Pixel Rate 78.4 GPixel/s | Pixel Rate 70.4 GPixel/s |
Texture Rate 156.8 GTexel/s | Texture Rate 123.2 GTexel/s |
Shaders 1,024 Shaders | Shaders 1,792 Shaders |
TMUs 64 TMUs | TMUs 112 TMUs |
ROPs 32 ROPs | ROPs 64 ROPs |
Tensor Cores 128 T-Cores | Tensor Cores 56 T-Cores |
RT Cores 8 RT-Cores | RT Cores 28 RT-Cores |
EUs 128 EUs | CUs 28 CUs |
Base Clock 2GHz | Base Clock 1GHz |
Boost Clock 2.45GHz | Boost Clock 1.1GHz |
L2 Cache 4.1MB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.16TB/s |
6GB GDDR6 | 8GB GDDR6 |
Memory Bus 96-bit | Memory Bus 128-bit |
Memory Speed 15.5GT/s | Memory Speed 10.8GT/s |
Memory Bandwidth 186.1GB/s | Memory Bandwidth 172.8GB/s |
TDP 75W | TDP 55W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 3x DisplayPort 2.1 |
3x DisplayPort 2.0 | - |
1x HDMI 2.1 | 1x HDMI 2.1 |
Encoder Model Arc | Encoder Model VCN 4.0 |
Decoder Model Arc | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2.1-Slots | PCIe 2-Slots |
Height 114 mm (4.49")Width 222 mm (8.74")Depth 42 mm (1.65") | Height 115 mm (4.53")Width 204 mm (8.03")Depth 40 mm (1.57") |
Cooling Open-Air 1x Fan | Cooling Open-Air 2x Fans |
Power Connectors - | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename Hotpink Bonefish |
Chip Variant DG2-128 | Chip Variant Navi 33 XL |
Market Segment Desktop | Market Segment Desktop |
Release Date Jun 28, 2022 | Release Date Aug 8, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node N6 |
Die Size 157mm² | Die Size 204mm² |
Transistor Count 7.2 Billion | Transistor Count 13.3 Billion |
Transistor Density 45.86 MTr/mm² | Transistor Density 65.2 MTr/mm² |
No images available
No images available



