Intel Arc A530M vs Intel Arc A570M Full Specs
1,536 Shaders 1.2GHz | 2,048 Shaders 1.3GHz |
4GB GDDR6224GB/s | 8GB GDDR6256GB/s |
·· 3.69 TFLOPS | ·· 5.33 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 65W | TDP 75W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 118 TOPSINT4 Tensor | Peak OPS 170.4 TOPSINT4 Tensor |
Tensor FP16-32 29.49 TFLOPS | Tensor FP16-32 42.6 TFLOPS |
Tensor BF16 29.49 TFLOPS | Tensor BF16 42.6 TFLOPS |
FP32 3.69 TFLOPS | FP32 5.33 TFLOPS |
FP64 921.6 GFLOPS | FP64 1.33 TFLOPS |
Tensor INT4 118 TOPS | Tensor INT4 170.4 TOPS |
Tensor INT8 58.98 TOPS | Tensor INT8 85.2 TOPS |
Pixel Rate 57.6 GPixel/s | Pixel Rate 83.2 GPixel/s |
Texture Rate 115.2 GTexel/s | Texture Rate 166.4 GTexel/s |
Shaders 1,536 Shaders | Shaders 2,048 Shaders |
TMUs 96 TMUs | TMUs 128 TMUs |
ROPs 48 ROPs | ROPs 64 ROPs |
Tensor Cores 192 T-Cores | Tensor Cores 256 T-Cores |
RT Cores 12 RT-Cores | RT Cores 16 RT-Cores |
EUs 192 EUs | EUs 256 EUs |
Base Clock 300MHz | Base Clock 300MHz |
Boost Clock 1.2GHz | Boost Clock 1.3GHz |
L2 Cache 8MB shared | L2 Cache 8MB shared |
4GB GDDR6 | 8GB GDDR6 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 14GT/s | Memory Speed 16GT/s |
Memory Bandwidth 224GB/s | Memory Bandwidth 256GB/s |
ECC No | ECC No |
TDP 65W | TDP 75W |
Max Resolution 7680x4320 | Max Resolution 7680x4320 |
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz | Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz |
Multi-Monitor 4 | Multi-Monitor 4 |
Adaptive Sync FreeSync | Adaptive Sync FreeSync |
DSC Not Supported | DSC Not Supported |
Shader Model 6.6 | Shader Model 6.6 |
DirectX DirectX 12Direct3D 12_2 | DirectX DirectX 12Direct3D 12_2 |
OpenGL 4.6OpenCL 3Vulkan 1.3 | OpenGL 4.6OpenCL 3Vulkan 1.3 |
Encoder Arc | Encoder Arc |
Codec AVC (H.264) HEVC (H.265) AV1 | Codec AVC (H.264) HEVC (H.265) AV1 |
Decoder Arc | Decoder Arc |
Codec MPEG-2 JPEG VP9 AVC (H.264) HEVC (H.265) AV1 | Codec MPEG-2 JPEG VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor Soldered | Form Factor Soldered |
PCIe PCIe 4.0 x16 | PCIe PCIe 4.0 x16 |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename Xe HPG |
Chip Variant DG2-256 | Chip Variant DG2-256 |
Market Segment Laptop | Market Segment Laptop |
Release Date Aug 1, 2023 | Release Date Aug 1, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node N6 |
Die Size 269mm² | Die Size 269mm² |
Transistor Count 11.5B | Transistor Count 11.5B |
Transistor Density 42.75 MTr/mm² | Transistor Density 42.75 MTr/mm² |


