Arc A570M
Radeon Pro 580X
Intel Arc A570M vs Apple Radeon Pro 580X Full Specs
2,048 Shaders 1.3GHz | 2,304 Shaders 1.2GHz |
8GB GDDR6256GB/s | 8GB GDDR5217.6GB/s |
·· 5.33 TFLOPS | ·· 5.53 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 75W | TDP 125W |
Arc A570M170.4 TOPSINT4 Tensor
Radeon Pro 580X5.53 TFLOPSFP16Clock Speed ··· | Clock Speed ··· |
Peak OPS 170.4 TOPSINT4 Tensor | Peak OPS 5.53 TFLOPSFP16 |
Tensor FP16-32 42.6 TFLOPS | - |
Tensor BF16 42.6 TFLOPS | - |
FP32 5.33 TFLOPS | FP32 5.53 TFLOPS |
FP64 1.33 TFLOPS | FP64 345.6 GFLOPS |
Tensor INT4 170.4 TOPS | Tensor INT4 - |
Tensor INT8 85.2 TOPS | - |
Pixel Rate 83.2 GPixel/s | Pixel Rate 38.4 GPixel/s |
Texture Rate 166.4 GTexel/s | Texture Rate 172.8 GTexel/s |
Shaders 2,048 Shaders | Shaders 2,304 Shaders |
TMUs 128 TMUs | TMUs 144 TMUs |
ROPs 64 ROPs | ROPs 32 ROPs |
Tensor Cores 256 T-Cores | Tensor Cores - |
RT Cores 16 RT-Cores | RT Cores - |
EUs 256 EUs | CUs 36 CUs |
Base Clock 300MHz | Base Clock 1.1GHz |
Boost Clock 1.3GHz | Boost Clock 1.2GHz |
L1 - | L1 16KB/CU |
L2 Cache 8MB shared | L2 Cache 2MB shared |
8GB GDDR6 | 8GB GDDR5 |
Memory Bus 128-bit | Memory Bus 256-bit |
Memory Speed 16GT/s | Memory Speed 6.8GT/s |
Memory Bandwidth 256GB/s | Memory Bandwidth 217.6GB/s |
ECC No | ECC No |
TDP 75W | TDP 125W |
Max Resolution 7680x4320 | Max Resolution 5120x2880 |
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz | Refresh Rate Calculator 5120x2880 Resolution5K Refresh Rate 60Hz |
Multi-Monitor 4 | Multi-Monitor 3 |
Adaptive Sync FreeSync | Adaptive Sync FreeSync |
DSC Not Supported | DSC Not Supported |
HDCP - | HDCP HDCP 2.2 |
Shader Model 6.6 | Shader Model 6.7 |
DirectX DirectX 12Direct3D 12_2 | DirectX DirectX 12Direct3D 12_0 |
OpenGL 4.6OpenCL 3Vulkan 1.3 | OpenGL 4.6OpenCL 2.1Vulkan 1.3 |
- | GFX 8 |
Encoder Arc | Encoder VCE 3.0 |
Codec AVC (H.264) HEVC (H.265) AV1 | Codec AVC (H.264) HEVC (H.265) - |
Decoder Arc | Decoder UVD 6.3 |
Codec - MPEG-2 - JPEG - VP9 AVC (H.264) HEVC (H.265) AV1 | Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 - AVC (H.264) HEVC (H.265) - |
Form Factor Soldered | Form Factor Soldered |
PCIe PCIe 4.0 x16 | PCIe PCIe 3.0 x16 |
Multi-GPU - | Multi-GPU Multi-GPU Support SupportedMulti-GPU Type CrossFire XDMA |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Xe HPG | Codename Ellesmere |
Chip Variant DG2-256 | Chip Variant Polaris 20 XL |
Market Segment Laptop | Market Segment Laptop |
Release Date Aug 1, 2023 | Release Date Mar 18, 2019 |
Foundry TSMC | Foundry GlobalFoundries |
Fabrication Node N6 | Fabrication Node 14LPP |
Die Size 269mm² | Die Size 232mm² |
Transistor Count 11.5B | Transistor Count 5.7B |
Transistor Density 42.75 MTr/mm² | Transistor Density 24.57 MTr/mm² |
All-in-Ones - | All-in-Ones |