Intel Arc Pro A60 vs AMD Radeon PRO W7500 Full Specs
2,048 Shaders 2.05GHz | 1,792 Shaders 1.7GHz |
12GB GDDR6384GB/s | 8GB GDDR6172GB/s |
·· 8.4 TFLOPS | ·· 12.19 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 130W | TDP 70W |
Arc Pro A60268.7 TOPSINT4 Tensor
Radeon PRO W750048.74 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 268.7 TOPSINT4 Tensor | Peak OPS 48.74 TOPSINT4 Tensor |
Tensor FP16-16 -Tensor FP16-32 67.17 TFLOPS | Tensor FP16-16 12.19 TFLOPSTensor FP16-32 12.19 TFLOPS |
BF16 -Tensor BF16 67.17 TFLOPS | BF16 24.37 TFLOPSTensor BF16 12.19 TFLOPS |
FP32 8.4 TFLOPS | FP32 12.19 TFLOPS |
FP64 2.1 TFLOPS | FP64 380.8 GFLOPS |
Tensor INT4 268.7 TOPS | Tensor INT4 48.74 TOPS |
Tensor INT8 134.3 TOPS | Tensor INT8 12.19 TOPS |
Pixel Rate 131.2 GPixel/s | Pixel Rate 108.8 GPixel/s |
Texture Rate 262.4 GTexel/s | Texture Rate 190.4 GTexel/s |
Shaders 2,048 Shaders | Shaders 1,792 Shaders |
TMUs 128 TMUs | TMUs 112 TMUs |
ROPs 64 ROPs | ROPs 64 ROPs |
Tensor Cores 256 T-Cores | Tensor Cores 56 T-Cores |
RT Cores 16 RT-Cores | RT Cores 28 RT-Cores |
EUs 256 EUs | CUs 28 CUs |
Base Clock 900MHz | Base Clock 1.5GHz |
Boost Clock 2.05GHz | Boost Clock 1.7GHz |
L2 Cache 8.2MB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.17TB/s |
12GB GDDR6 | 8GB GDDR6 |
Memory Bus 192-bit | Memory Bus 128-bit |
Memory Speed 16GT/s | Memory Speed 10.8GT/s |
Memory Bandwidth 384GB/s | Memory Bandwidth 172GB/s |
TDP 130W | TDP 70W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 4x DisplayPort 2.1 |
4x Mini DisplayPort 2.0 | - |
Encoder Model Arc | Encoder Model VCN 4.0 |
Decoder Model Arc | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 1-Slots |
- | Height 115 mm (4.53")Width 216 mm (8.5")Depth 20 mm (0.79") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Xe HPG | Codename Hotpink Bonefish |
Chip Variant DG2-256 | Chip Variant Navi 33 XL |
Market Segment Workstation | Market Segment Workstation |
Release Date Jun 6, 2023 | Release Date Aug 3, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node N6 |
Die Size 269mm² | Die Size 204mm² |
Transistor Count 11.5 Billion | Transistor Count 13.3 Billion |
Transistor Density 42.75 MTr/mm² | Transistor Density 65.2 MTr/mm² |
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