Intel Graphics 2C 2300MHz vs NVIDIA GeForce GTX 765M Full Specs

Summary

256 Shaders 2.3GHz	768 Shaders 863MHz
Shared Memory119.5GB/s LPDDR5X·DDR5	2GB GDDR564GB/s placeholder
Peak·FP32·FP16 1.18 TFLOPS	Peak·FP32·FP16 1.33 TFLOPS
Form Factor iGPU	Form Factor Soldered
TDP Shared	TDP 65W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Graphics 2C 2300MHz37.68 TOPSINT4 Tensor

x28.43

GeForce GTX 765M1.33 TFLOPSFP32

x1

Show Top Score

Theoretical Performance

Clock Speed2300MHz UC·Boost·OC	Clock Speed863MHz UC·Boost·OC
Peak OPS 37.68 TOPSINT4 Tensor	Peak OPS 1.33 TFLOPSFP32
Tensor FP16-32 9.42 TFLOPS	-
Tensor BF16 9.42 TFLOPS	-
FP32 1.18 TFLOPS	FP32 1.33 TFLOPS
FP64 294.4 GFLOPS	FP64 55.23 GFLOPS
Tensor INT4 37.68 TOPS	Tensor INT4 -
Tensor INT8 18.84 TOPS	-
Pixel Rate 18.4 GPixel/s	Pixel Rate 13.8 GPixel/s
Texture Rate 36.8 GTexel/s	Texture Rate 55.2 GTexel/s

Core Config

Shaders 256 Shaders	Shaders 768 Shaders
TMUs 16 TMUs	TMUs 64 TMUs
ROPs 8 ROPs	ROPs 16 ROPs
Tensor Cores 16 T-Cores	Tensor Cores -
RT Cores 2 RT-Cores	RT Cores -
EUs 16 EUs	SMs 4 SMs

Clocks

Boost Clock 2.3GHz

Boost Clock 863MHz

Cache

L2 Cache 4.1MB shared

L2 Cache 512KB shared

Memory

Shared Memory LPDDR5X·DDR5	2GB GDDR5 placeholder
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 7.5GT/s	Memory Speed 4GT/s
Memory Bandwidth 119.5GB/s	Memory Bandwidth 64GB/s
ECC No	ECC No

Power & Thermals

TDP Shared

TDP 65W

Video Output

Multi-Monitor 3

Multi-Monitor 2

Encoder

Encoder Model Xe Media Engine

Encoder Model NVENC 1

Decoder

Decoder Model Xe Media Engine

Decoder Model NVDEC 1

Card

Form Factor iGPU

Form Factor Soldered

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Battlemage	Architecture Kepler
Family Gen 13	Family GeForce 700
Branding	Branding
Codename Xe3 LPG	Codename NVE6
Chip Variant GT1	Chip Variant -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 5, 2026	Release Date May 1, 2013

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 3	Fabrication Node 28nm
Die Size 27mm²	Die Size 221mm²
Transistor Count -	Transistor Count 2.5 Billion
Transistor Density -	Transistor Density 11.49 MTr/mm²

Images

No images available

No images available

Used In

CPUs Core Ultra 5 322 Core Ultra 5 332	CPUs -
Laptops -	Laptops Blade 14(Mid 2013)Blade Pro 17(Mid 2013)

Competitors

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NVIDIAGeForce GTX 765M vs GPU AMDRadeon 840M 2900MHz NVIDIAGeForce GTX 765M vs GPU NVIDIAGeForce RTX 5050 Laptop 60W NVIDIAGeForce GTX 765M vs GPU NVIDIAGeForce RTX 5050 Laptop 80W Show 12 more