HD 400 500MHz
PowerVR G6430 640MHz
Intel HD 400 500MHz vs Imagination PowerVR G6430 640MHz Full Specs
96 Shaders 500MHz | 128 Shaders 640MHz |
Shared Memory12.8GB/sDDR3L | Shared Memory12.8GB/sLPDDR3 |
·· 96 GFLOPS | ·· 163.8 GFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
HD 400 500MHz192 GFLOPSFP16
PowerVR G6430 640MHz245.8 GFLOPSFP16Clock Speed ··· | Clock Speed ·· |
Peak OPS 192 GFLOPSFP16 | Peak OPS 245.8 GFLOPSFP16 |
FP32 96 GFLOPS | FP32 163.8 GFLOPS |
FP64 24 GFLOPS | FP64 10.24 GFLOPS |
Pixel Rate 1 GPixel/s | Pixel Rate 5.1 GPixel/s |
Texture Rate 6 GTexel/s | Texture Rate 5.1 GTexel/s |
Shaders 96 Shaders | Shaders 128 Shaders |
TMUs 12 TMUs | TMUs 8 TMUs |
ROPs 2 ROPs | ROPs 8 ROPs |
EUs 12 EUs | EUs 8 EUs |
Base Clock 200MHz | Base Clock - |
Boost Clock 500MHz | Boost Clock 640MHz |
Shared MemoryDDR3L | Shared MemoryLPDDR3 |
Memory Bus 64-bit | Memory Bus 64-bit |
Memory Speed 1.6GT/s | Memory Speed 1.6GT/s |
Memory Bandwidth 12.8GB/s | Memory Bandwidth 12.8GB/s |
ECC No | ECC No |
Max Resolution 4096x2304 | Max Resolution 2048x1536 |
Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 68Hz | Refresh Rate Calculator 1920x1080 Resolution1080p FHD Refresh Rate 91Hz |
Multi-Monitor 2 | Multi-Monitor 1 |
DSC Not Supported | DSC Not Supported |
Shader Model 5.1 | Shader Model - |
DirectX DirectX 12Direct3D 11_1 | DirectX DirectX 9Direct3D 9_3 |
OpenGL 4.4OpenCL 3Vulkan 1 | OpenGL 2.1OpenCL 1.2Vulkan 1.1 |
Encoder Quick Sync Video 4 | - |
Codec JPEG AVC (H.264) | Codec - |
Decoder Quick Sync Video 4 | - |
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP8 AVC (H.264) | Codec - |
Form Factor iGPU | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Braswell | Codename Series6 |
Chip Variant GT1 | Chip Variant - |
Market Segment Tablet | Market Segment Smartphone |
Release Date Apr 1, 2015 | Release Date Sep 1, 2015 |
Foundry Intel | Foundry Intel |
Fabrication Node 14nm | Fabrication Node 22nm |
Die Size 87mm² | Die Size 100mm² |
Transistor Count 1.3B | Transistor Count 800M |
Transistor Density 15 MTr/mm² | Transistor Density 8 MTr/mm² |