Intel HD 630 950MHz

HD 630 950MHz

AMD Radeon R1E 1CU 267MHz GCN 2

Radeon R1E 1CU 267MHz GCN 2

Intel HD 630 950MHz vs AMD Radeon R1E 1CU 267MHz GCN 2 Full Specs

192 Shaders
950MHz
64 Shaders
267MHz
Shared Memory38.4GB/s
··
Shared Memory21.3GB/sDDR3
··
364.8 GFLOPS
··
34.18 GFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

HD 630 950MHzHD 630 950MHz364.8 GFLOPSFP16
x10.67
Radeon R1E 1CU 267MHz GCN 2Radeon R1E 1CU 267MHz GCN 234.18 GFLOPSFP32
x1

Clock Speed
···
Clock Speed
··
Peak OPS
364.8 GFLOPSFP16
Peak OPS
34.18 GFLOPSFP32
FP32
364.8 GFLOPS
FP32
34.18 GFLOPS
FP64
91.2 GFLOPS
FP64
2.14 GFLOPS
Pixel Rate
2.9 GPixel/s
Pixel Rate
1.1 GPixel/s
Texture Rate
22.8 GTexel/s
Texture Rate
2.1 GTexel/s

Shaders
192 Shaders
Shaders
64 Shaders
TMUs
24 TMUs
TMUs
8 TMUs
ROPs
3 ROPs
ROPs
4 ROPs
EUs
24 EUs
CU
1 CU

Base Clock
350MHz
Base Clock
-
Boost Clock
950MHz
Boost Clock
267MHz

L1
-
L1
16KB/CU
L2 Cache
-
L2 Cache
64KB shared

Shared Memory
··
Shared MemoryDDR3
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
2.4GT/s
Memory Speed
1.3GT/s
Memory Bandwidth
38.4GB/s
Memory Bandwidth
21.3GB/s
ECC
No
ECC
No

Max Resolution
4096x2304
Max Resolution
4096x2160
Refresh Rate Calculator
3840x2160
Resolution4K UHD
Refresh Rate
68Hz
Refresh Rate Calculator
3840x2160
Resolution4K UHD
Refresh Rate
64Hz
Multi-Monitor
3
Multi-Monitor
3
DSC
Not Supported
DSC
Not Supported

Shader Model
6.4
Shader Model
6.5
DirectX
DirectX 12
Direct3D
12_1
DirectX
DirectX 12
Direct3D
12_0
OpenGL
4.6
OpenCL
3
Vulkan
1.2
OpenGL
4.6
OpenCL
2.1
Vulkan
1.2
-
GFX
7

Encoder
Quick Sync Video 6
Encoder
VCE 2.0
Codec
JPEG
VP9
AVC (H.264)
HEVC (H.265)
Codec
-
-
AVC (H.264)
-

Decoder
Quick Sync Video 6
Decoder
UVD 4.2
Codec
MPEG-1
MPEG-2
MPEG-4
JPEG
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
Codec
MPEG-1
MPEG-2
MPEG-4
-
VC-1
-
-
AVC (H.264)
-

Form Factor
iGPU
Form Factor
iGPU
Cooling
Passive
Cooling
Open-Air

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
HD 2016 branding
Branding
Radeon 2016 branding
Codename
Kaby Lake
Codename
Kalindi
Chip Variant
GT1
Chip Variant
Kalindi LP
Market Segment
Desktop
Market Segment
Laptop
Release Date
Jan 3, 2017
Release Date
Feb 23, 2016

Foundry
Intel
Foundry
GlobalFoundries
Fabrication Node
14nm+
Fabrication Node
28nm
Die Size
103mm²
Die Size
107mm²
Transistor Count
1.8B
Transistor Count
930M
Transistor Density
17 MTr/mm²
Transistor Density
9 MTr/mm²