Intel Iris Xe 80EU 1200MHz vs NVIDIA GeForce RTX 3070 Ti Laptop 125W Full Specs
640 Shaders 1.2GHz | 5,888 Shaders 1.49GHz |
Shared Memory83.2GB/s ··· | 8GB GDDR6448GB/s placeholder |
·· 1.54 TFLOPS | ·· 17.49 TFLOPS |
Form Factor iGPU | Form Factor Soldered |
TDP Shared | TDP 125W |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 3.07 TFLOPSFP16 | Peak OPS 559.6 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 69.95 TFLOPSFP16-16 Tensor Sparse 139.9 TFLOPSTensor FP16-32 34.97 TFLOPSFP16-32 Tensor Sparse 69.95 TFLOPS |
- | BF16 17.49 TFLOPSTensor BF16 34.97 TFLOPSBF16 Tensor Sparse 69.95 TFLOPS |
Tensor TF32 - | Tensor TF32 17.49 TFLOPS |
FP32 1.54 TFLOPS | FP32 17.49 TFLOPS |
FP64 384 GFLOPS | FP64 273.2 GFLOPS |
Tensor INT4 - | Tensor INT4 279.8 TOPS |
- | Tensor INT8 139.9 TOPS |
Ray - | Ray 26.37 TOPS |
Pixel Rate 24 GPixel/s | Pixel Rate 142.6 GPixel/s |
Texture Rate 48 GTexel/s | Texture Rate 273.2 GTexel/s |
Shaders 640 Shaders | Shaders 5,888 Shaders |
TMUs 40 TMUs | TMUs 184 TMUs |
ROPs 20 ROPs | ROPs 96 ROPs |
Tensor Cores - | Tensor Cores 184 T-Cores |
RT Cores - | RT Cores 46 RT-Cores |
EUs 80 EUs | SMs 46 SMs |
Base Clock - | Base Clock 1.03GHz |
Boost Clock 1.2GHz | Boost Clock 1.49GHz |
L2 Cache 896KB shared | L2 Cache 4.1MB shared |
L3 Cache 3MB shared | L3 Cache - |
Shared Memory ··· | 8GB GDDR6 placeholder |
Memory Bus 128-bit | Memory Bus 256-bit |
Memory Speed 5.2GT/s | Memory Speed 14GT/s |
Memory Bandwidth 83.2GB/s | Memory Bandwidth 448GB/s |
ECC No | ECC No |
TDP Shared | TDP 125W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
Encoder Model Quick Sync Video 8 | Encoder Model NVENC 7 |
Decoder Model Quick Sync Video 8 | Decoder Model NVDEC 5 |
Form Factor iGPU | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe LP | Codename NV174 |
Chip Variant GT1 | Chip Variant GA104-150-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Aug 1, 2022 | Release Date Jan 12, 2021 |
Foundry Intel | Foundry Samsung |
Fabrication Node Intel 7 | Fabrication Node 8N |
Die Size 161mm² | Die Size 393mm² |
Transistor Count 11.9 Billion | Transistor Count 17.4 Billion |
Transistor Density 74 MTr/mm² | Transistor Density 44.33 MTr/mm² |
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