GPUs

NVIDIA GeForce RTX 3050 Laptop 80W vs AMD Radeon RX 6700M Full Specs

2,048 Shaders
1.74GHz
2,304 Shaders
2.4GHz
4GB GDDR6192GB/s
12GB GDDR6384GB/s
··
7.13 TFLOPS
··
11.06 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
80W
TDP
135W

GeForce RTX 3050 Laptop 80WGeForce RTX 3050 Laptop 80W228.1 TOPSINT4 Tensor Sparse
x10.31
Radeon RX 6700MRadeon RX 6700M22.12 TFLOPSFP16
x1

Clock Speed
···
Clock Speed
···
Peak OPS
228.1 TOPSINT4 Tensor Sparse
Peak OPS
22.12 TFLOPSFP16
Tensor FP16-16
28.51 TFLOPS
FP16-16 Tensor Sparse
57.02 TFLOPS
Tensor FP16-32
14.25 TFLOPS
FP16-32 Tensor Sparse
28.51 TFLOPS
-
BF16
7.13 TFLOPS
Tensor BF16
14.25 TFLOPS
BF16 Tensor Sparse
28.51 TFLOPS
-
Tensor TF32
7.13 TFLOPS
Tensor TF32
-
FP32
7.13 TFLOPS
FP32
11.06 TFLOPS
FP64
111.4 GFLOPS
FP64
691.2 GFLOPS
Tensor INT4
114 TOPS
Tensor INT4
-
Tensor INT8
57.02 TOPS
-
Ray
10.75 TOPS
Ray
-
Pixel Rate
55.7 GPixel/s
Pixel Rate
153.6 GPixel/s
Texture Rate
111.4 GTexel/s
Texture Rate
345.6 GTexel/s

Shaders
2,048 Shaders
Shaders
2,304 Shaders
TMUs
64 TMUs
TMUs
144 TMUs
ROPs
32 ROPs
ROPs
64 ROPs
Tensor Cores
64 T-Cores
Tensor Cores
-
RT Cores
16 RT-Cores
RT Cores
36 RT-Cores
SMs
16 SMs
CUs
36 CUs

Base Clock
1.49GHz
Base Clock
1.49GHz
Boost Clock
1.74GHz
Boost Clock
2.4GHz

L2 Cache
2MB shared
L2 Cache
3.1MB shared
L3 Cache
-
L3 Cache
80MB shared
L3 Bandwidth
-
L3 Bandwidth
1.25TB/s

4GB GDDR6
12GB GDDR6
Memory Bus
128-bit
Memory Bus
192-bit
Memory Speed
12GT/s
Memory Speed
16GT/s
Memory Bandwidth
192GB/s
Memory Bandwidth
384GB/s
ECC
No
ECC
No

TDP
80W
TDP
135W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 2.3
HDCP
HDCP 2.3

Encoder Model
NVENC 7
Encoder Model
VCN 3.0

Decoder Model
NVDEC 5
Decoder Model
VCN 3.0

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce RTX 2018 branding
Branding
Radeon 2020 branding
Codename
NV177
Codename
Navy Flounder
Chip Variant
GA107-140-A1
Chip Variant
Navi 22 XT
Market Segment
Laptop
Market Segment
Laptop
Release Date
May 11, 2021
Release Date
Jun 1, 2021

Foundry
Samsung
Foundry
TSMC
Fabrication Node
8N
Fabrication Node
N7
Die Size
200mm²
Die Size
335mm²
Transistor Count
8.7 Billion
Transistor Count
17.2 Billion
Transistor Density
43.5 MTr/mm²
Transistor Density
51.34 MTr/mm²

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