NVIDIA GeForce RTX 3050 Laptop 80W vs AMD Radeon RX 6700M Full Specs
2,048 Shaders 1.74GHz | 2,304 Shaders 2.4GHz |
4GB GDDR6192GB/s | 12GB GDDR6384GB/s |
·· 7.13 TFLOPS | ·· 11.06 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 80W | TDP 135W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 228.1 TOPSINT4 Tensor Sparse | Peak OPS 22.12 TFLOPSFP16 |
Tensor FP16-16 28.51 TFLOPSFP16-16 Tensor Sparse 57.02 TFLOPSTensor FP16-32 14.25 TFLOPSFP16-32 Tensor Sparse 28.51 TFLOPS | - |
BF16 7.13 TFLOPSTensor BF16 14.25 TFLOPSBF16 Tensor Sparse 28.51 TFLOPS | - |
Tensor TF32 7.13 TFLOPS | Tensor TF32 - |
FP32 7.13 TFLOPS | FP32 11.06 TFLOPS |
FP64 111.4 GFLOPS | FP64 691.2 GFLOPS |
Tensor INT4 114 TOPS | Tensor INT4 - |
Tensor INT8 57.02 TOPS | - |
Ray 10.75 TOPS | Ray - |
Pixel Rate 55.7 GPixel/s | Pixel Rate 153.6 GPixel/s |
Texture Rate 111.4 GTexel/s | Texture Rate 345.6 GTexel/s |
Shaders 2,048 Shaders | Shaders 2,304 Shaders |
TMUs 64 TMUs | TMUs 144 TMUs |
ROPs 32 ROPs | ROPs 64 ROPs |
Tensor Cores 64 T-Cores | Tensor Cores - |
RT Cores 16 RT-Cores | RT Cores 36 RT-Cores |
SMs 16 SMs | CUs 36 CUs |
Base Clock 1.49GHz | Base Clock 1.49GHz |
Boost Clock 1.74GHz | Boost Clock 2.4GHz |
L2 Cache 2MB shared | L2 Cache 3.1MB shared |
L3 Cache - | L3 Cache 80MB shared |
L3 Bandwidth - | L3 Bandwidth 1.25TB/s |
4GB GDDR6 | 12GB GDDR6 |
Memory Bus 128-bit | Memory Bus 192-bit |
Memory Speed 12GT/s | Memory Speed 16GT/s |
Memory Bandwidth 192GB/s | Memory Bandwidth 384GB/s |
ECC No | ECC No |
TDP 80W | TDP 135W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP HDCP 2.3 |
Encoder Model NVENC 7 | Encoder Model VCN 3.0 |
Decoder Model NVDEC 5 | Decoder Model VCN 3.0 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV177 | Codename Navy Flounder |
Chip Variant GA107-140-A1 | Chip Variant Navi 22 XT |
Market Segment Laptop | Market Segment Laptop |
Release Date May 11, 2021 | Release Date Jun 1, 2021 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N7 |
Die Size 200mm² | Die Size 335mm² |
Transistor Count 8.7 Billion | Transistor Count 17.2 Billion |
Transistor Density 43.5 MTr/mm² | Transistor Density 51.34 MTr/mm² |
No images available
No images available



