NVIDIA GeForce RTX 4060 Laptop 115W vs Intel Arc A370M Full Specs
3,072 Shaders 2.37GHz | 1,024 Shaders 1.55GHz |
8GB GDDR6256GB/s | 4GB GDDR6112GB/s |
·· 14.56 TFLOPS | ·· 3.17 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 115W | TDP 35W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 466 TOPSINT4 Tensor Sparse | Peak OPS 101.6 TOPSINT4 Tensor |
Tensor FP8-16 116.5 TFLOPSFP8-16 Tensor Sparse 233 TFLOPSTensor FP8-32 58.25 TFLOPSFP8-32 Tensor Sparse 116.5 TFLOPS | - |
Tensor FP16-16 58.25 TFLOPSFP16-16 Tensor Sparse 116.5 TFLOPSTensor FP16-32 29.12 TFLOPSFP16-32 Tensor Sparse 58.25 TFLOPS | Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 25.4 TFLOPSFP16-32 Tensor Sparse - |
BF16 14.56 TFLOPSTensor BF16 29.12 TFLOPSBF16 Tensor Sparse 58.25 TFLOPS | BF16 -Tensor BF16 25.4 TFLOPSBF16 Tensor Sparse - |
Tensor TF32 14.56 TFLOPS | Tensor TF32 - |
FP32 14.56 TFLOPS | FP32 3.17 TFLOPS |
FP64 227.5 GFLOPS | FP64 793.6 GFLOPS |
Tensor INT4 233 TOPS | Tensor INT4 101.6 TOPS |
Tensor INT8 116.5 TOPS | Tensor INT8 50.79 TOPS |
Ray 33.66 TOPS | Ray - |
Pixel Rate 113.8 GPixel/s | Pixel Rate 49.6 GPixel/s |
Texture Rate 227.5 GTexel/s | Texture Rate 99.2 GTexel/s |
Shaders 3,072 Shaders | Shaders 1,024 Shaders |
TMUs 96 TMUs | TMUs 64 TMUs |
ROPs 48 ROPs | ROPs 32 ROPs |
Tensor Cores 96 T-Cores | Tensor Cores 128 T-Cores |
RT Cores 24 RT-Cores | RT Cores 8 RT-Cores |
SMs 24 SMs | EUs 128 EUs |
Base Clock 2.29GHz | Base Clock 300MHz |
Boost Clock 2.37GHz | Boost Clock 1.55GHz |
L2 Cache 32.8MB shared | L2 Cache 4.1MB shared |
8GB GDDR6 | 4GB GDDR6 |
Memory Bus 128-bit | Memory Bus 64-bit |
Memory Speed 16GT/s | Memory Speed 14GT/s |
Memory Bandwidth 256GB/s | Memory Bandwidth 112GB/s |
ECC No | ECC No |
TDP 115W | TDP 35W |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
Encoder Model NVENC 8 | Encoder Model Arc |
Decoder Model NVDEC 5 | Decoder Model Arc |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV187 | Codename Xe HPG |
Chip Variant AD107 | Chip Variant DG2-128 |
Market Segment Laptop | Market Segment Laptop |
Release Date Feb 22, 2023 | Release Date Mar 30, 2022 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 4N | Fabrication Node N6 |
Die Size 159mm² | Die Size 157mm² |
Transistor Count 18.9 Billion | Transistor Count 7.2 Billion |
Transistor Density 118.9 MTr/mm² | Transistor Density 45.86 MTr/mm² |
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