Intel Core i3-L13G4 vs Qualcomm Snapdragon 7c Gen 2 Full Specs

Summary

5 Cores(1P+4E) 6 Threads(2P+4E) 800MHz	8 Cores(2P+6E) 8 Threads(2P+6E) 2.55GHz
Bandwidth 34.1GB/s LPDDR4X	Bandwidth 17.1GB/s LPDDR4X
iGPU UHD 48EU 500MHz Gen 11	iGPU Adreno 618
Peak·FP32·FP16 768 GFLOPSFP16	Peak·FP32·FP16 844.8 GFLOPSFP16
Socket CSP 1016	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS

Core i3-L13G4646

x1

Snapdragon 7c Gen 2-

-

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Core Config

5 Cores 1P 4E	8 Cores 2P 6E
6 Threads 2P 4E	8 Threads 2P 6E

Clocks

Base Clock 800MHz	Base Clock 2.55GHz
Boost Clock 2.8GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 32KB E	L1i 64KB P 32KB E
L1d 48KB P 32KB E	L1d 64KB P 32KB E
L2 512KB P - 1.5MB E shared	L2 512KB P 128KB E -
L3 8MB	L3 -
SLC Cache -	SLC Cache 1MB

Memory

Type LPDDR4X	Type LPDDR4X
Max Memory 8GB	Max Memory 16GB
ECC No	ECC No
Channels 1	Channels 2
Bus Width 64-bit	Bus Width 32-bit
Speed 4266MT/s	Speed 4266MT/s
Bandwidth 34.1GB/s	Bandwidth 17.1GB/s
Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 34.1GB/s	Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 17.1GB/s

Power & Thermals

Max Operating Temp 100°C Max	Max Operating Temp -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type OPI	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 4GT/s	Bus Speed -
Bus Bandwidth 2GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 3.0 x6 5.9GB/sBandwidth

-

iGPU

iGPU UHD 48EU 500MHz Gen 11	iGPU Adreno 618
Shaders 384	Shaders 256
Boost Clock 500MHz	Boost Clock 825MHz
Peak·FP32·FP16 768 GFLOPSFP16	Peak·FP32·FP16 844.8 GFLOPSFP16

NPU

NPU Model -	NPU Model Hexagon 692
Performance -	Performance 5 TOPS

Cellular

Modem Model -	Modem Model X15
Peak Down -	Peak Down Up to 800Mbps
Peak Up -	Peak Up Up to 150Mbps

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Lakefield	Architecture Kryo 468ARMv8.2-A
Family Core 11th Gen	Family 7 Series
Branding	Branding
Codename Lakefield Sunny CoveP-Core TremontE-Core	Codename - Cortex-A76P-Core Cortex-A55E-Core
Market Segment Laptop	Market Segment Laptop
Release Date May 28, 2020	Release Date May 19, 2021

Fabrication

Foundry Intel	Foundry Samsung
Other Foundries IntelIO	Other Foundries -
Fabrication Node 10nm+ 22nmIO	Fabrication Node 8LPP -
Die Size 82mm² 92mm²IO	Die Size -
Transistor Count 4 Billion 650 MillionIO	Transistor Count -
Transistor Density 49 MTr/mm² 7 MTr/mm²IO	Transistor Density -

Images

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Used In

Laptops Galaxy Book S(Mid 2020)

Laptops Galaxy Book Go(Mid 2021)

Competitors

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