AMD Ryzen 5 PRO 220 vs Intel Core i3-L13G4 Full Specs

Summary

6 Cores(2P+4E) 12 Threads(4P+8E) 3.2GHz	5 Cores(1P+4E) 6 Threads(2P+4E) 800MHz
TDP 28W	TDP -
Bandwidth 120GB/s LPDDR5X·DDR5	Bandwidth 34.1GB/s LPDDR4X
iGPU Radeon 740M 2800MHz	iGPU UHD 48EU 500MHz Gen 11
Peak·FP32·FP16 2.87 TFLOPSFP16	Peak·FP32·FP16 768 GFLOPSFP16
Socket FP8	Socket CSP 1016

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Ryzen 5 PRO 2202,250

x3.48

Core i3-L13G4646

x1

Show Top Score

Core Config

6 Cores 2P 4E	5 Cores 1P 4E
12 Threads 4P 8E	6 Threads 2P 4E

Clocks

Base Clock 3.2GHz	Base Clock 800MHz
Boost Clock 4.9GHz	Boost Clock 2.8GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 32KB P 32KB E
L1d 32KB P -	L1d 48KB P 32KB E
L2 1MB P -	L2 512KB P 1.5MB E shared
L3 16MB	L3 8MB

Memory

Type LPDDR5X·DDR5	Type LPDDR4X
Max Memory 256GB	Max Memory 8GB
ECC No	ECC No
Channels 2	Channels 1
Bus Width 128-bit	Bus Width 64-bit
Speed 7500MT/s	Speed 4266MT/s
Bandwidth 120GB/s	Bandwidth 34.1GB/s
Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 120GB/s	Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 34.1GB/s

Power & Thermals

TDP 28W	TDP -
cTDP-down 15W	cTDP-down -
cTDP-up 30W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type PCIe	Bus Type OPI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 4GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 2GB/s

Expansion

PCIe PCIe 4.0 x14 27.6GB/sBandwidth

PCIe PCIe 3.0 x6 5.9GB/sBandwidth

iGPU

iGPU Radeon 740M 2800MHz	iGPU UHD 48EU 500MHz Gen 11
Shaders 256	Shaders 384
Boost Clock 2.8GHz	Boost Clock 500MHz
Peak·FP32·FP16 2.87 TFLOPSFP16	Peak·FP32·FP16 768 GFLOPSFP16

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 4	Architecture Lakefield
Family Ryzen 200	Family Core 11th Gen
Branding	Branding
Codename Hawk Point Hawk Point SVariant Zen 4P-Core Zen 4cE-Core	Codename Lakefield - Sunny CoveP-Core TremontE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date May 28, 2020

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries IntelIO
Fabrication Node N4 -	Fabrication Node 10nm+ 22nmIO
Die Size 137mm² -	Die Size 82mm² 92mm²IO
Transistor Count 20.9 Billion -	Transistor Count 4 Billion 650 MillionIO
Transistor Density 153 MTr/mm² -	Transistor Density 49 MTr/mm² 7 MTr/mm²IO

Images

No images available

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Used In

Laptops -

Laptops Galaxy Book S(Mid 2020)

Competitors

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