Apple A7 vs NVIDIA Tegra 3 Full Specs

Summary

2 Cores 2 Threads 1.3GHz	5 Cores(1P+4E) 5 Threads(1P+4E) 1.5GHz
TDP 5W	TDP -
Bandwidth 12.8GB/s LPDDR3	Bandwidth 6GB/s DDR3L·LPDDR2
iGPU PowerVR G6430 A7	iGPU Tegra 3
Peak·FP32·FP16 192 GFLOPSFP16	Peak·FP32·FP16 16.64 GFLOPSFP16

Core Config

2 Cores 2P -	5 Cores 1P 4E
2 Threads 2P -	5 Threads 1P 4E

Clocks

Base Clock 1.3GHz	Base Clock 1.5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P	L1i 32KB P
L1d 64KB P	L1d 32KB P
L2 1MB P shared	L2 1MB P shared
L3 4MB	L3 -

Memory

Type LPDDR3	Type DDR3L·LPDDR2
Max Memory 1GB	Max Memory -
ECC No	ECC No
Channels 1	Channels 1
Bus Width 64-bit	Bus Width 32-bit
Speed 1600MT/s	Speed 1500MT/s
Bandwidth 12.8GB/s	Bandwidth 6GB/s
Bandwidth Calculator Channels Transfer Rate1600MT/s UC·Spec·OC 12.8GB/s	Bandwidth Calculator Channels Transfer Rate1500MT/s UC·Spec·OC 6GB/s

Power & Thermals

TDP 5W

TDP -

iGPU

iGPU PowerVR G6430 A7	iGPU Tegra 3
Shaders 128	Shaders 8
Boost Clock 375MHz	Boost Clock 520MHz
Peak·FP32·FP16 192 GFLOPSFP16	Peak·FP32·FP16 16.64 GFLOPSFP16

Chip

Manufacturer Apple	Manufacturer NVIDIA
ISA AArch64	ISA AArch32
Architecture Apple Silicon 2ARMv8.0-A	Architecture ARMv7ARMv7
Family A Series	Family -
Branding	Branding
Codename Alcatraz A7Variant CycloneP-Core -	Codename Kal-El - Cortex-A9P-Core Cortex-A9E-Core
Market Segment Smartphone	Market Segment Tablet
Release Date Sep 20, 2013	Release Date Nov 1, 2011

Fabrication

Foundry Samsung	Foundry TSMC
Fabrication Node 28nm	Fabrication Node 40nm LPG
Die Size 102mm²	Die Size -
Transistor Count 1 Billion	Transistor Count -
Transistor Density 10 MTr/mm²	Transistor Density -

Images

Used In

Smartphones iPhone 5S	Smartphones -
Tablets iPad mini 2(A7, Late 2013)iPad mini 3(A7, Late 2014)	Tablets Surface RT(Tegra 3, Late 2012)

Competitors

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