Apple M5 Pro (18C20G) vs Intel Core i3-2375M Full Specs

Summary

18 Cores(6P+12M) 18 Threads(6P+12M) 4.61GHz	2 Cores 4 Threads 1.5GHz
TDP 60W	TDP 17W
Bandwidth 307.2GB/s LPDDR5X	Bandwidth 21.3GB/s DDR3
iGPU 20-Core M5 Pro	iGPU 0
Peak·FP32·FP16 16.59 TFLOPSFP16	Peak·FP32·FP16 -
Socket -	Socket BGA 1023

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M5 Pro (18C20G)4,268

x16.61

Core i3-2375M257

x1

Show Top Score

Core Config

18 Cores 6P 12M	2 Cores 2P -
18 Threads 6P 12M	4 Threads 4P -

Clocks

Base Clock 4.61GHz	Base Clock 1.5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 192KB M	L1i 32KB P -
L1d 128KB P 128KB M	L1d 32KB P -
L2 1MB P 16MB P shared 16MB M shared	L2 256KB P - -
L3 -	L3 3MB
SLC Cache 24MB	SLC Cache -

Memory

Type LPDDR5X	Type DDR3
Max Memory 64GB	Max Memory 16GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 256-bit	Bus Width 128-bit
Speed 9600MT/s	Speed 1333MT/s
Bandwidth 307.2GB/s	Bandwidth 21.3GB/s
Bandwidth Calculator Channels Transfer Rate9600MT/s Calculated Bandwidth 307.2GB/s	Bandwidth Calculator Channels Transfer Rate1333MT/s Calculated Bandwidth 21.3GB/s

Power & Thermals

TDP 60W	TDP 17W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type DMI
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 5GT/s
Bus Bandwidth -	Bus Bandwidth 2.5GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 2.0 x16 8GB/sBandwidth

iGPU

iGPU 20-Core M5 Pro	iGPU 0
Shaders 2560	Shaders -
Boost Clock 1.62GHz	Boost Clock -
Peak·FP32·FP16 16.59 TFLOPSFP16	Peak·FP32·FP16 -

NPU

NPU Model H17 Hyperion	NPU Model -
NPU Cores 16	NPU Cores -
NPU Clock 2.45GHz	NPU Clock -
Performance 38 TOPSINT8	Performance -

Chip

Manufacturer Apple	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Apple Silicon 15ARMv9.2-A	Architecture Sandy Bridge
Family M Series	Family Core 2nd Gen
Branding	Branding
Codename Sotra-C - M5 ProVariant AS15PP-Core AS15MM-Core	Codename Gladden Sandy Bridge-M-2Die Sandy Bridge-2C-GT1Variant - -
Market Segment Laptop	Market Segment Laptop
Release Date Mar 3, 2026	Release Date Jan 1, 2013

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N3P	Fabrication Node 32nm
Die Size -	Die Size 131mm²
Transistor Count -	Transistor Count 504 Million
Transistor Density -	Transistor Density 4 MTr/mm²

Images

No images available

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Used In

Laptops MacBook Pro 16(M5 Pro, Early 2026)MacBook Pro 14(M5 Pro, Early 2026)

Laptops -

Competitors

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IntelCore i3-2375M vs CPU AppleM4 (8C9G-FL) IntelCore i3-2375M vs CPU AppleM4 (10C8G-FL) IntelCore i3-2375M vs CPU AppleM5 Pro (15C16G) Show 6 more