HiSilicon Kirin 650 vs Samsung Exynos 7 Octa 7870 Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 2GHz	8 Cores 8 Threads 1.6GHz
TDP 5W	TDP 5W
Bandwidth 14.9GB/s LPDDR3	Bandwidth 7.5GB/s LPDDR3
iGPU Mali-T830 MP2 900MHz	iGPU Mali-T830 MP1 700MHz
Peak·FP32·FP16 36 GFLOPSFP32	Peak·FP32·FP16 14 GFLOPSFP32

Core Config

8 Cores 4P 4E	8 Cores 8P -
8 Threads 4P 4E	8 Threads 8P -

Clocks

Base Clock 2GHz	Base Clock 1.6GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 16KB P 16KB E	L1i -
L1d 16KB P 16KB E	L1d -
L2 128KB E 1MB P shared	L2 - -

Memory

Type LPDDR3	Type LPDDR3
ECC No	ECC No
Channels 2	Channels 1
Bus Width 64-bit	Bus Width 32-bit
Speed 1866MT/s	Speed 1866MT/s
Bandwidth 14.9GB/s	Bandwidth 7.5GB/s
Bandwidth Calculator Channels Transfer Rate1866MT/s UC·Spec·OC 14.9GB/s	Bandwidth Calculator Channels Transfer Rate1866MT/s UC·Spec·OC 7.5GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU Mali-T830 MP2 900MHz	iGPU Mali-T830 MP1 700MHz
Shaders 20	Shaders 10
Boost Clock 900MHz	Boost Clock 700MHz
Peak·FP32·FP16 36 GFLOPSFP32	Peak·FP32·FP16 14 GFLOPSFP32

Cellular

Modem Model Balong 720	Modem Model Shannon 300/50
Peak Down Up to 300Mbps	Peak Down Up to 300Mbps
Peak Up Up to 50Mbps	Peak Up Up to 50Mbps

Chip

Manufacturer HiSilicon	Manufacturer Samsung
ISA AArch64	ISA AArch64
Architecture ARMv8.0-A	Architecture ARMv8.0-A
Branding	Branding
Codename Cortex-A53P-Core Cortex-A53E-Core	Codename Cortex-A53P-Core -
Market Segment Smartphone	Market Segment Smartphone
Release Date May 1, 2016	Release Date Jan 1, 2016

Fabrication

Foundry Samsung	Foundry Samsung
Fabrication Node 28nm LP	Fabrication Node 28nm LP

Images

Competitors

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SamsungExynos 7 Octa 7870 vs HiSiliconKirin 650 SamsungExynos 7 Octa 7870 vs CPU HiSiliconKirin 955 SamsungExynos 7 Octa 7870 vs CPU QualcommSnapdragon 652 Show 12 more