Intel Core i3-1115G4 vs Qualcomm Snapdragon 8 Gen 3 Full Specs

Summary

2 Cores 4 Threads 2.2GHz	8 Cores(1P+5M+2E) 8 Threads(1P+5M+2E) 3.3GHz
TDP 15W	TDP 5W
Bandwidth 59.7GB/s LPDDR4X·DDR4	Bandwidth 76.8GB/s LPDDR5X
iGPU UHD 48EU 1250MHz Gen 12	iGPU Adreno 750
Peak·FP32·FP16 1.92 TFLOPSFP16	Peak·FP32·FP16 5.53 TFLOPSFP16
Socket BGA 1449	Socket -

Core Config

2 Cores 2P - -	8 Cores 1P 5M 2E
4 Threads 4P - -	8 Threads 1P 5M 2E

Clocks

Base Clock 2.2GHz	Base Clock 3.3GHz
Boost Clock 4.1GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P - -	L1i 64KB P 64KB M 32KB E
L1d 48KB P - -	L1d 64KB P 64KB M 32KB E
L2 1.25MB P - -	L2 1MB P 512KB M 128KB E
L3 6MB	L3 12MB
SLC Cache -	SLC Cache 4MB

Memory

Type LPDDR4X·DDR4	Type LPDDR5X
Max Memory 32GB	Max Memory 24GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 64-bit
Speed 3733MT/s	Speed 9600MT/s
Bandwidth 59.7GB/s	Bandwidth 76.8GB/s
Bandwidth Calculator Channels Transfer Rate3733MT/s UC·Spec·OC 59.7GB/s	Bandwidth Calculator Channels Transfer Rate9600MT/s UC·Spec·OC 76.8GB/s

Power & Thermals

TDP 15W	TDP 5W
cTDP-down 12W	cTDP-down -
cTDP-up 28W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type OPI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 4GT/s	Bus Speed -
Bus Bandwidth 4GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x4 7.9GB/sBandwidth

-

iGPU

iGPU UHD 48EU 1250MHz Gen 12	iGPU Adreno 750
Shaders 384	Shaders 1536
Boost Clock 1.25GHz	Boost Clock 900MHz
Peak·FP32·FP16 1.92 TFLOPSFP16	Peak·FP32·FP16 5.53 TFLOPSFP16

NPU

NPU Model GNA 2.0	NPU Model Hexagon
Performance -	Performance 45 TOPSINT8

Cellular

Modem Model -	Modem Model X75
Cellular -	Cellular 5G mmWave
Peak Down -	Peak Down Up to 10.0Gbps
Peak Up -	Peak Up Up to 3.5Gbps

Controller

Controller Model 500 Series UP3+	Controller Model -
Codename Tiger Lake	Codename -
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Tiger Lake	Architecture KryoARMv9.0-A
Family Core 11th Gen	Family 8 Series
Branding	Branding
Codename Tiger Lake-UP3 Tiger Lake-4C-GT2Variant Willow CoveP-Core - -	Codename - Snapdragon 8 Gen 3Variant Cortex-X4P-Core Cortex-A720M-Core Cortex-A520E-Core
Market Segment Laptop	Market Segment Smartphone
Release Date Sep 2, 2020	Release Date Oct 24, 2023

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries IntelPCH	Other Foundries -
Fabrication Node 10nm SuperFin 14nmPCH	Fabrication Node N4P -
Die Size 123mm² 46mm²PCH	Die Size 137mm² -
Transistor Count 8 Billion	Transistor Count -
Transistor Density 65 MTr/mm²	Transistor Density -

Images

Used In

Laptops XPS 13(9310, Late 2020)XPS 13 2-in-1(29310, Late 2020)Galaxy Book Pro 360 13(Early 2021) Show 1 more	Laptops -
Smartphones -	Smartphones OnePlus 12OnePlus 13R
Tablets Surface Pro 7+(Intel 11th Gen, Early 2021)Surface Pro 8(Intel 11th Gen, Late 2021)	Tablets OnePlus Pad 2(SD 8G3, Mid 2024)

Competitors

IntelCore i3-1115G4 vs CPU IntelCore i3-1115G4E IntelCore i3-1115G4 vs CPU IntelCore i3-1115GRE IntelCore i3-1115G4 vs CPU IntelCore i3-1110G4 Show 12 more

QualcommSnapdragon 8 Gen 3 vs CPU QualcommSnapdragon 8s Gen 3 QualcommSnapdragon 8 Gen 3 vs CPU QualcommSnapdragon 8 Gen 3 Galaxy QualcommSnapdragon 8 Gen 3 vs CPU QualcommSnapdragon 8 Elite Show 12 more