Intel Core i3-1115G4 vs Qualcomm Snapdragon 865+ Full Specs

Summary

2 Cores 4 Threads 2.2GHz	8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.1GHz
TDP 15W	TDP 5W
Bandwidth 59.7GB/s LPDDR4X·DDR4	Bandwidth 44GB/s LPDDR5·LPDDR4X
iGPU UHD 48EU 1250MHz Gen 12	iGPU Adreno 650+
Peak·FP32·FP16 1.92 TFLOPSFP16	Peak·FP32·FP16 2.06 TFLOPSFP16
Socket BGA 1449	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i3-1115G41,625

x1.43

Snapdragon 865+1,134

x1

Show Top Score

Core Config

2 Cores 2P - -	8 Cores 1P 3M 4E
4 Threads 4P - -	8 Threads 1P 3M 4E

Clocks

Base Clock 2.2GHz	Base Clock 3.1GHz
Boost Clock 4.1GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P - -	L1i 64KB P 64KB M 32KB E
L1d 48KB P - -	L1d 64KB P 64KB M 32KB E
L2 1.25MB P - -	L2 512KB P 256KB M 128KB E
L3 6MB	L3 4MB
SLC Cache -	SLC Cache 3MB

Memory

Type LPDDR4X·DDR4	Type LPDDR5·LPDDR4X
Max Memory 32GB	Max Memory 24GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 64-bit
Speed 3733MT/s	Speed 5500MT/s
Bandwidth 59.7GB/s	Bandwidth 44GB/s
Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 59.7GB/s	Bandwidth Calculator Channels Transfer Rate5500MT/s Calculated Bandwidth 44GB/s

Power & Thermals

TDP 15W	TDP 5W
cTDP-down 12W	cTDP-down -
cTDP-up 28W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type OPI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 4GT/s	Bus Speed -
Bus Bandwidth 4GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x4 7.9GB/sBandwidth

-

iGPU

iGPU UHD 48EU 1250MHz Gen 12	iGPU Adreno 650+
Shaders 384	Shaders 768
Boost Clock 1.25GHz	Boost Clock 670MHz
Peak·FP32·FP16 1.92 TFLOPSFP16	Peak·FP32·FP16 2.06 TFLOPSFP16

NPU

NPU Model GNA 2.0	NPU Model Hexagon 698
NPU Clock -	NPU Clock 576MHz
Performance -	Performance 15 TOPS

Cellular

Modem Model -	Modem Model X55
Cellular -	Cellular 5G mmWave
Peak Down -	Peak Down Up to 7.5Gbps
Peak Up -	Peak Up Up to 3.0Gbps

Controller

Controller Model 500 Series UP3+	Controller Model -
Codename Tiger Lake	Codename -
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Tiger Lake	Architecture Kryo 585ARMv8.2-A
Family Core 11th Gen	Family 8 Series
Branding	Branding
Codename Tiger Lake-UP3 Tiger Lake-4C-GT2Variant Willow CoveP-Core - -	Codename - - Cortex-A77P-Core Cortex-A77M-Core Cortex-A55E-Core
Market Segment Laptop	Market Segment Smartphone
Release Date Sep 2, 2020	Release Date Aug 30, 2020

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries IntelPCH	Other Foundries -
Fabrication Node 10nm SuperFin 14nmPCH	Fabrication Node N7P -
Die Size 123mm² 46mm²PCH	Die Size 84mm² -
Transistor Count 8 Billion	Transistor Count 10.3 Billion
Transistor Density 65 MTr/mm²	Transistor Density 123 MTr/mm²

Images

No images available

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Used In

Laptops XPS 13(9310, Late 2020)XPS 13 2-in-1(29310, Late 2020)Galaxy Book Pro 360 13(Early 2021) Show 1 more	Laptops -
Tablets Surface Pro 7+(Intel 11th Gen, Early 2021)Surface Pro 8(Intel 11th Gen, Late 2021)	Tablets Galaxy Tab S7(SD 865+, Mid 2020)Galaxy Tab S7+(SD 865+, Mid 2020)

Competitors

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