CPUs

Intel Core i5-1135G7 vs Qualcomm Snapdragon 8cx Gen 2 Full Specs

4 Cores
8 Threads
1.4GHz
8 Cores(4P+4E)
8 Threads(4P+4E)
3.15GHz
TDP
15W
TDP
-
Bandwidth
59.7GB/s
·
Bandwidth
68.3GB/s
LPDDR4X
iGPU
iGPU
··
3.33 TFLOPSFP16
··
4.18 TFLOPSFP16
Socket
Socket
-

Core i5-1135G7Core i5-1135G71,670
x1
Snapdragon 8cx Gen 2Snapdragon 8cx Gen 2-
-

4 Cores
4P
-
8 Cores
4P
4E
8 Threads
8P
-
8 Threads
4P
4E

Base Clock
1.4GHz
Base Clock
3.15GHz
Boost Clock
4.2GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
-
L1i
64KB P
32KB E
L1d
48KB P
-
L1d
64KB P
32KB E
L2
1.25MB P
-
L2
512KB P
128KB E
L3
8MB
L3
2MB
SLC Cache
-
SLC Cache
3MB

Type
·
Type
LPDDR4X
Max Memory
32GB
Max Memory
16GB
ECC
No
ECC
No
Channels
2
Channels
8
Bus Width
128-bit
Bus Width
128-bit
Speed
3733MT/s
Speed
4266MT/s
Bandwidth
59.7GB/s
Bandwidth
68.3GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
59.7GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
68.3GB/s

TDP
15W
TDP
-
cTDP-down
12W
cTDP-down
-
cTDP-up
28W
cTDP-up
-
Max Operating Temp
100°C Max
Max Operating Temp
-

Bus Type
OPI
Bus Type
-
Bus Config
8 lanes
Bus Config
-
Bus Speed
4GT/s
Bus Speed
-
Bus Bandwidth
4GB/s
Bus Bandwidth
-

PCIe
PCIe 4.0 x4
7.9GB/sBandwidth
-

iGPU
iGPU
Shaders
640
Shaders
1536
Boost Clock
1.3GHz
Boost Clock
680MHz
··
3.33 TFLOPSFP16
··
4.18 TFLOPSFP16

NPU Model
GNA 2.0
NPU Model
Hexagon 690
Performance
-
Performance
9 TOPS

Modem Model
-
Modem Model
X55
Cellular
-
Cellular
5G mmWave
Peak Down
-
Peak Down
Up to 7.5Gbps
Peak Up
-
Peak Up
Up to 3.0Gbps

Controller Model
500 Series UP3+
Controller Model
-
Codename
Tiger Lake
Codename
-
PCIe
-
PCIe
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
AArch64
Architecture
Architecture
Kryo 495ARMv8.2-A
Family
Family
Branding
Core i5 2020 branding
Branding
Snapdragon 8cx Gen 2  branding
Codename
Tiger Lake-H35
Tiger Lake-4C-GT3Variant
Willow CoveP-Core
-
Codename
-
Snapdragon 8cx Gen 2Variant
Cortex-A76P-Core
Cortex-A55E-Core
Market Segment
Laptop
Market Segment
Laptop
Release Date
Sep 2, 2020
Release Date
Aug 30, 2020

Foundry
Intel
Foundry
TSMC
Other Foundries
IntelPCH
Other Foundries
-
Fabrication Node
10nm SuperFin
14nmPCH
Fabrication Node
N7
-
Die Size
146mm²
55mm²PCH
Die Size
-
Transistor Count
9.5 Billion
Transistor Count
-
Transistor Density
65 MTr/mm²
Transistor Density
-

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