CPUs

Qualcomm Snapdragon 720G vs Intel Core i3-1115G4 Full Specs

8 Cores(2P+6E)
8 Threads(2P+6E)
2.3GHz
2 Cores
4 Threads
2.2GHz
TDP
5W
TDP
15W
Bandwidth
14.9GB/s
LPDDR4X
Bandwidth
59.7GB/s
·
iGPU
iGPU
··
844.8 GFLOPSFP16
··
1.92 TFLOPSFP16
Socket
-
Socket

Snapdragon 720G738
x1
Core i3-1115G4Core i3-1115G41,625
x2.20

8 Cores
2P
6E
2 Cores
2P
-
8 Threads
2P
6E
4 Threads
4P
-

Base Clock
2.3GHz
Base Clock
2.2GHz
Boost Clock
-
Boost Clock
4.1GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
32KB E
L1i
32KB P
-
L1d
64KB P
32KB E
L1d
48KB P
-
L2
512KB P
128KB E
L2
1.25MB P
-
L3
2MB
L3
6MB
SLC Cache
1MB
SLC Cache
-

Type
LPDDR4X
Type
·
Max Memory
16GB
Max Memory
32GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
32-bit
Bus Width
128-bit
Speed
3733MT/s
Speed
3733MT/s
Bandwidth
14.9GB/s
Bandwidth
59.7GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
14.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
59.7GB/s

TDP
5W
TDP
15W
cTDP-down
-
cTDP-down
12W
cTDP-up
-
cTDP-up
28W
Max Operating Temp
-
Max Operating Temp
100°C Max

Bus Type
-
Bus Type
OPI
Bus Config
-
Bus Config
8 lanes
Bus Speed
-
Bus Speed
4GT/s
Bus Bandwidth
-
Bus Bandwidth
4GB/s

-
PCIe
PCIe 4.0 x4
7.9GB/sBandwidth

iGPU
iGPU
Shaders
256
Shaders
384
Boost Clock
825MHz
Boost Clock
1.25GHz
··
844.8 GFLOPSFP16
··
1.92 TFLOPSFP16

NPU Model
Hexagon 692
NPU Model
GNA 2.0

Modem Model
X15
Modem Model
-
Peak Down
Up to 800Mbps
Peak Down
-
Peak Up
Up to 150Mbps
Peak Up
-

Controller Model
-
Controller Model
500 Series UP3+
Codename
-
Codename
Tiger Lake
PCIe
-
PCIe
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
x86-64
Architecture
Kryo 465ARMv8.2-A
Architecture
Family
Family
Branding
Snapdragon  branding
Branding
Core i3 2020 branding
Codename
-
-
Cortex-A76P-Core
Cortex-A55E-Core
Codename
Tiger Lake-UP3
Tiger Lake-4C-GT2Variant
Willow CoveP-Core
-
Market Segment
Smartphone
Market Segment
Laptop
Release Date
Jan 20, 2020
Release Date
Sep 2, 2020

Foundry
Samsung
Foundry
Intel
Other Foundries
-
Other Foundries
IntelPCH
Fabrication Node
8LPP
-
Fabrication Node
10nm SuperFin
14nmPCH
Die Size
-
Die Size
123mm²
46mm²PCH
Transistor Count
-
Transistor Count
8 Billion
Transistor Density
-
Transistor Density
65 MTr/mm²

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