Qualcomm Snapdragon 865+ vs Intel Core i3-1115G4 Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.1GHz	2 Cores 4 Threads 2.2GHz
TDP 5W	TDP 15W
Bandwidth 44GB/s LPDDR5·LPDDR4X	Bandwidth 59.7GB/s LPDDR4X·DDR4
iGPU Adreno 650+	iGPU UHD 48EU 1250MHz Gen 12
Peak·FP32·FP16 2.06 TFLOPSFP16	Peak·FP32·FP16 1.92 TFLOPSFP16
Socket -	Socket BGA 1449

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 865+1,134

x1

Core i3-1115G41,625

x1.43

Show Top Score

Core Config

8 Cores 1P 3M 4E	2 Cores 2P - -
8 Threads 1P 3M 4E	4 Threads 4P - -

Clocks

Base Clock 3.1GHz	Base Clock 2.2GHz
Boost Clock -	Boost Clock 4.1GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 32KB P - -
L1d 64KB P 64KB M 32KB E	L1d 48KB P - -
L2 512KB P 256KB M 128KB E	L2 1.25MB P - -
L3 4MB	L3 6MB
SLC Cache 3MB	SLC Cache -

Memory

Type LPDDR5·LPDDR4X	Type LPDDR4X·DDR4
Max Memory 24GB	Max Memory 32GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 64-bit	Bus Width 128-bit
Speed 5500MT/s	Speed 3733MT/s
Bandwidth 44GB/s	Bandwidth 59.7GB/s
Bandwidth Calculator Channels Transfer Rate5500MT/s Calculated Bandwidth 44GB/s	Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 59.7GB/s

Power & Thermals

TDP 5W	TDP 15W
cTDP-down -	cTDP-down 12W
cTDP-up -	cTDP-up 28W
Max Operating Temp -	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type OPI
Bus Config -	Bus Config 8 lanes
Bus Speed -	Bus Speed 4GT/s
Bus Bandwidth -	Bus Bandwidth 4GB/s

Expansion

-	PCIe PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU Adreno 650+	iGPU UHD 48EU 1250MHz Gen 12
Shaders 768	Shaders 384
Boost Clock 670MHz	Boost Clock 1.25GHz
Peak·FP32·FP16 2.06 TFLOPSFP16	Peak·FP32·FP16 1.92 TFLOPSFP16

NPU

NPU Model Hexagon 698	NPU Model GNA 2.0
NPU Clock 576MHz	NPU Clock -
Performance 15 TOPS	Performance -

Cellular

Modem Model X55	Modem Model -
Cellular 5G mmWave	Cellular -
Peak Down Up to 7.5Gbps	Peak Down -
Peak Up Up to 3.0Gbps	Peak Up -

Controller

Controller Model -	Controller Model 500 Series UP3+
Codename -	Codename Tiger Lake
PCIe -	PCIe -

Chip

Manufacturer Qualcomm	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Kryo 585ARMv8.2-A	Architecture Tiger Lake
Family 8 Series	Family Core 11th Gen
Branding	Branding
Codename - - Cortex-A77P-Core Cortex-A77M-Core Cortex-A55E-Core	Codename Tiger Lake-UP3 Tiger Lake-4C-GT2Variant Willow CoveP-Core - -
Market Segment Smartphone	Market Segment Laptop
Release Date Aug 30, 2020	Release Date Sep 2, 2020

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries IntelPCH
Fabrication Node N7P -	Fabrication Node 10nm SuperFin 14nmPCH
Die Size 84mm² -	Die Size 123mm² 46mm²PCH
Transistor Count 10.3 Billion	Transistor Count 8 Billion
Transistor Density 123 MTr/mm²	Transistor Density 65 MTr/mm²

Images

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Used In

Laptops -	Laptops XPS 13(9310, Late 2020)XPS 13 2-in-1(29310, Late 2020)Galaxy Book Pro 360 13(Early 2021) Show 1 more
Tablets Galaxy Tab S7(SD 865+, Mid 2020)Galaxy Tab S7+(SD 865+, Mid 2020)	Tablets Surface Pro 7+(Intel 11th Gen, Early 2021)Surface Pro 8(Intel 11th Gen, Late 2021)

Competitors

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IntelCore i3-1115G4 vs CPU IntelCore Ultra 5 332 IntelCore i3-1115G4 vs CPU IntelCore Ultra 5 322 IntelCore i3-1115G4 vs CPU IntelCore Ultra 5 325 Show 12 more