GPUs

ATI FireGL V8650 vs ATI FirePro 3D V3750 Full Specs

320 Shaders
688MHz
320 Shaders
550MHz
2GB GDDR4111.1GB/s
262MB GDDR324GB/s
··
440.3 GFLOPS
··
352 GFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
-
TDP
48W
Power Connectors
1x 8-Pin
1x 6-Pin
Power Connectors
-

FireGL V8650FireGL V8650440.3 GFLOPSFP32
x1.25
FirePro 3D V3750FirePro 3D V3750352 GFLOPSFP32
x1

Clock Speed
··
Clock Speed
··
Peak OPS
440.3 GFLOPSFP32
Peak OPS
352 GFLOPSFP32
FP32
440.3 GFLOPS
FP32
352 GFLOPS
Pixel Rate
11 GPixel/s
Pixel Rate
4.4 GPixel/s
Texture Rate
11 GTexel/s
Texture Rate
17.6 GTexel/s

Shaders
320 Shaders
Shaders
320 Shaders
TMUs
16 TMUs
TMUs
32 TMUs
ROPs
16 ROPs
ROPs
8 ROPs
CUs
4 CUs
CUs
4 CUs

Boost Clock
688MHz
Boost Clock
550MHz

L2 Cache
-
L2 Cache
256KB shared

2GB GDDR4
262MB GDDR3
Memory Bus
512-bit
Memory Bus
128-bit
Memory Speed
1.7GT/s
Memory Speed
1.5GT/s
Memory Bandwidth
111.1GB/s
Memory Bandwidth
24GB/s
ECC
No
ECC
No

TDP
-
TDP
48W

Multi-Monitor
2
Multi-Monitor
2

-
2x DisplayPort 1.0
2x DVI-I Dual-Link
1x DVI-I Dual-Link
1x S-Video
-

-
Decoder Model
UVD 2.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
1-Slots
Height
111 mm (4.37")
Width
254 mm (10")
Depth
37 mm (1.46")
Height
111 mm (4.37")
Width
168 mm (6.61")
Depth
20 mm (0.79")
Cooling
Blower
1x Fan
Cooling
Blower
1x Fan
Power Connectors
1x 8-Pin, 1x 6-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
FireGL branding
Branding
FirePro branding
Codename
Pele
Codename
Mario
Chip Variant
R600 GT
Chip Variant
RV730 Pro
Market Segment
Workstation
Market Segment
Workstation
Release Date
Aug 6, 2007
Release Date
Sep 11, 2008

Foundry
TSMC
Foundry
TSMC
Fabrication Node
80nm
Fabrication Node
55nm
Die Size
420mm²
Die Size
146mm²
Transistor Count
720 Million
Transistor Count
514 Million
Transistor Density
1.71 MTr/mm²
Transistor Density
3.52 MTr/mm²

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