GPUs

ATI FirePro 3D V3750 vs AMD Radeon PRO W7400 Full Specs

320 Shaders
550MHz
1,792 Shaders
1.1GHz
262MB GDDR324GB/s
8GB GDDR6172.8GB/s
··
352 GFLOPS
··
7.88 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
48W
TDP
55W

FirePro 3D V3750FirePro 3D V3750352 GFLOPSFP32
x1
Radeon PRO W7400Radeon PRO W740031.54 TOPSINT4 Tensor
x89.60

Clock Speed
··
Clock Speed
···
Peak OPS
352 GFLOPSFP32
Peak OPS
31.54 TOPSINT4 Tensor
-
Tensor FP16-16
7.88 TFLOPS
Tensor FP16-32
7.88 TFLOPS
-
BF16
15.77 TFLOPS
Tensor BF16
7.88 TFLOPS
FP32
352 GFLOPS
FP32
7.88 TFLOPS
-
FP64
246.4 GFLOPS
Tensor INT4
-
Tensor INT4
31.54 TOPS
-
Tensor INT8
7.88 TOPS
Pixel Rate
4.4 GPixel/s
Pixel Rate
70.4 GPixel/s
Texture Rate
17.6 GTexel/s
Texture Rate
123.2 GTexel/s

Shaders
320 Shaders
Shaders
1,792 Shaders
TMUs
32 TMUs
TMUs
112 TMUs
ROPs
8 ROPs
ROPs
64 ROPs
Tensor Cores
-
Tensor Cores
56 T-Cores
RT Cores
-
RT Cores
28 RT-Cores
CUs
4 CUs
CUs
28 CUs

Base Clock
-
Base Clock
1GHz
Boost Clock
550MHz
Boost Clock
1.1GHz

L2 Cache
256KB shared
L2 Cache
2MB shared
L3 Cache
-
L3 Cache
32MB shared
L3 Bandwidth
-
L3 Bandwidth
1.17TB/s

262MB GDDR3
8GB GDDR6
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
1.5GT/s
Memory Speed
10.8GT/s
Memory Bandwidth
24GB/s
Memory Bandwidth
172.8GB/s
ECC
No
ECC
No

TDP
48W
TDP
55W

Multi-Monitor
2
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
4x DisplayPort 2.1
2x DisplayPort 1.0
-
1x DVI-I Dual-Link
-

-
Encoder Model
VCN 4.0

Decoder Model
UVD 2.0
Decoder Model
VCN 4.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
1-Slots
Height
111 mm (4.37")
Width
168 mm (6.61")
Depth
20 mm (0.79")
Height
115 mm (4.53")
Width
216 mm (8.5")
Depth
20 mm (0.79")
Cooling
Blower
1x Fan
Cooling
Blower
1x Fan

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
FirePro branding
Branding
Radeon Pro 2023 branding
Codename
Mario
Codename
Hotpink Bonefish
Chip Variant
RV730 Pro
Chip Variant
Navi 33 XL
Market Segment
Workstation
Market Segment
Workstation
Release Date
Sep 11, 2008
Release Date
Aug 7, 2025

Foundry
TSMC
Foundry
TSMC
Fabrication Node
55nm
Fabrication Node
N6
Die Size
146mm²
Die Size
204mm²
Transistor Count
514 Million
Transistor Count
13.3 Billion
Transistor Density
3.52 MTr/mm²
Transistor Density
65.2 MTr/mm²

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