ATI Radeon HD 3850 vs ATI Radeon HD 2900 Pro Full Specs
320 Shaders 668MHz | 320 Shaders 600MHz |
524MB GDDR457.6GB/s | 524MB GDDR3102.4GB/s |
·· 427.5 GFLOPS | ·· 384 GFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 75W | TDP 200W |
Power Connectors - 1x 6-Pin | Power Connectors 1x 8-Pin - |
Clock Speed ·· | Clock Speed ·· |
Peak OPS 427.5 GFLOPSFP32 | Peak OPS 384 GFLOPSFP32 |
FP32 427.5 GFLOPS | FP32 384 GFLOPS |
FP64 85.5 GFLOPS | - |
Pixel Rate 10.7 GPixel/s | Pixel Rate 9.6 GPixel/s |
Texture Rate 10.7 GTexel/s | Texture Rate 9.6 GTexel/s |
Shaders 320 Shaders | Shaders 320 Shaders |
TMUs 16 TMUs | TMUs 16 TMUs |
ROPs 16 ROPs | ROPs 16 ROPs |
CUs 4 CUs | CUs 4 CUs |
Boost Clock 668MHz | Boost Clock 600MHz |
L2 Cache 256KB shared | L2 Cache 256KB shared |
524MB GDDR4 | 524MB GDDR3 |
Memory Bus 256-bit | Memory Bus 512-bit |
Memory Speed 1.8GT/s | Memory Speed 1.6GT/s |
Memory Bandwidth 57.6GB/s | Memory Bandwidth 102.4GB/s |
TDP 75W | TDP 200W |
Multi-Monitor 2 | Multi-Monitor 2 |
2x DVI-I Dual-Link | 2x DVI-I Dual-Link |
1x S-Video | 1x S-Video |
Decoder Model UVD 1.0 | Decoder Model UVD 1.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 2-Slots |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Power Connectors 1x 6-Pin | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Boom | Codename Pele |
Chip Variant RV670 Pro | Chip Variant R600 GT |
Market Segment Desktop | Market Segment Desktop |
Release Date Nov 19, 2007 | Release Date Sep 25, 2007 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 55nm | Fabrication Node 80nm |
Die Size 192mm² | Die Size 420mm² |
Transistor Count 666 Million | Transistor Count 720 Million |
Transistor Density 3.47 MTr/mm² | Transistor Density 1.71 MTr/mm² |
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