ATI Radeon HD 2900 Pro vs AMD Radeon RX 7650 GRE Full Specs
320 Shaders 600MHz | 2,048 Shaders 2.69GHz |
524MB GDDR3102.4GB/s | 8GB GDDR6288GB/s |
·· 384 GFLOPS | ·· 22.08 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 200W | TDP 165W |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Radeon HD 2900 Pro384 GFLOPSFP32
Radeon RX 7650 GRE88.31 TOPSINT4 TensorClock Speed ·· | Clock Speed ··· |
Peak OPS 384 GFLOPSFP32 | Peak OPS 88.31 TOPSINT4 Tensor |
- | Tensor FP16-16 22.08 TFLOPSTensor FP16-32 22.08 TFLOPS |
- | BF16 44.15 TFLOPSTensor BF16 22.08 TFLOPS |
FP32 384 GFLOPS | FP32 22.08 TFLOPS |
- | FP64 689.9 GFLOPS |
Tensor INT4 - | Tensor INT4 88.31 TOPS |
- | Tensor INT8 22.08 TOPS |
Pixel Rate 9.6 GPixel/s | Pixel Rate 172.5 GPixel/s |
Texture Rate 9.6 GTexel/s | Texture Rate 345 GTexel/s |
Shaders 320 Shaders | Shaders 2,048 Shaders |
TMUs 16 TMUs | TMUs 128 TMUs |
ROPs 16 ROPs | ROPs 64 ROPs |
Tensor Cores - | Tensor Cores 64 T-Cores |
RT Cores - | RT Cores 32 RT-Cores |
CUs 4 CUs | CUs 32 CUs |
Base Clock - | Base Clock 1.72GHz |
Boost Clock 600MHz | Boost Clock 2.69GHz |
L2 Cache 256KB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.16TB/s |
524MB GDDR3 | 8GB GDDR6 |
Memory Bus 512-bit | Memory Bus 128-bit |
Memory Speed 1.6GT/s | Memory Speed 18GT/s |
Memory Bandwidth 102.4GB/s | Memory Bandwidth 288GB/s |
TDP 200W | TDP 165W |
Multi-Monitor 2 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 3x DisplayPort 2.1 |
- | 1x HDMI 2.1 |
2x DVI-I Dual-Link | - |
1x S-Video | - |
- | Encoder Model VCN 4.0 |
Decoder Model UVD 1.0 | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
- | Height 115 mm (4.53")Width 204 mm (8.03")Depth 40 mm (1.57") |
Cooling Blower 1x Fan | Cooling Open-Air 2x Fans |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Pele | Codename Hotpink Bonefish |
Chip Variant R600 GT | Chip Variant Navi 33 XL |
Market Segment Desktop | Market Segment Desktop |
Release Date Sep 25, 2007 | Release Date Feb 26, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 80nm | Fabrication Node N6 |
Die Size 420mm² | Die Size 204mm² |
Transistor Count 720 Million | Transistor Count 13.3 Billion |
Transistor Density 1.71 MTr/mm² | Transistor Density 65.2 MTr/mm² |
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