AMD FirePro M5725 vs ATI Mobility Radeon HD 560v Full Specs
320 Shaders 680MHz | 320 Shaders 550MHz |
262MB GDDR325.6GB/s | 1GB GDDR325.6GB/s |
·· 435.2 GFLOPS | ·· 352 GFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 25W | TDP 15W |
FirePro M5725435.2 GFLOPSFP32
Mobility Radeon HD 560v352 GFLOPSFP32Clock Speed ·· | Clock Speed ·· |
Peak OPS 435.2 GFLOPSFP32 | Peak OPS 352 GFLOPSFP32 |
FP32 435.2 GFLOPS | FP32 352 GFLOPS |
Pixel Rate 5.4 GPixel/s | Pixel Rate 4.4 GPixel/s |
Texture Rate 21.8 GTexel/s | Texture Rate 17.6 GTexel/s |
Shaders 320 Shaders | Shaders 320 Shaders |
TMUs 32 TMUs | TMUs 32 TMUs |
ROPs 8 ROPs | ROPs 8 ROPs |
CUs 4 CUs | CUs 4 CUs |
Boost Clock 680MHz | Boost Clock 550MHz |
L2 Cache 256KB shared | L2 Cache 256KB shared |
262MB GDDR3 | 1GB GDDR3 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 1.6GT/s | Memory Speed 1.6GT/s |
Memory Bandwidth 25.6GB/s | Memory Bandwidth 25.6GB/s |
TDP 25W | TDP 15W |
Multi-Monitor 2 | Multi-Monitor 2 |
Decoder Model UVD 2.0 | Decoder Model UVD 2.0 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Mario | Codename Mario |
Chip Variant RV730 Pro | Chip Variant RV730 Pro |
Market Segment Laptop | Market Segment Laptop |
Release Date Jan 1, 2009 | Release Date May 5, 2010 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 55nm | Fabrication Node 55nm |
Die Size 146mm² | Die Size 146mm² |
Transistor Count 514 Million | Transistor Count 514 Million |
Transistor Density 3.52 MTr/mm² | Transistor Density 3.52 MTr/mm² |
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