AMD FirePro W8100 vs AMD Radeon PRO W7600 Full Specs
2,560 Shaders 824MHz | 2,048 Shaders 2.44GHz |
8GB GDDR5320GB/s | 8GB GDDR6288GB/s |
·· 4.22 TFLOPS | ·· 19.99 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 220W | TDP 130W |
Power Connectors - 2x 6-Pin | Power Connectors 1x 8-Pin - |
FirePro W81004.22 TFLOPSFP32
Radeon PRO W760079.95 TOPSINT4 TensorClock Speed ·· | Clock Speed ··· |
Peak OPS 4.22 TFLOPSFP32 | Peak OPS 79.95 TOPSINT4 Tensor |
- | Tensor FP16-16 19.99 TFLOPSTensor FP16-32 19.99 TFLOPS |
- | BF16 39.98 TFLOPSTensor BF16 19.99 TFLOPS |
FP32 4.22 TFLOPS | FP32 19.99 TFLOPS |
FP64 527.4 GFLOPS | FP64 624.6 GFLOPS |
Tensor INT4 - | Tensor INT4 79.95 TOPS |
- | Tensor INT8 19.99 TOPS |
Pixel Rate 52.7 GPixel/s | Pixel Rate 156.2 GPixel/s |
Texture Rate 131.8 GTexel/s | Texture Rate 312.3 GTexel/s |
Shaders 2,560 Shaders | Shaders 2,048 Shaders |
TMUs 160 TMUs | TMUs 128 TMUs |
ROPs 64 ROPs | ROPs 64 ROPs |
Tensor Cores - | Tensor Cores 64 T-Cores |
RT Cores - | RT Cores 32 RT-Cores |
CUs 40 CUs | CUs 32 CUs |
Base Clock - | Base Clock 1.72GHz |
Boost Clock 824MHz | Boost Clock 2.44GHz |
L2 Cache 1MB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.17TB/s |
8GB GDDR5 | 8GB GDDR6 |
Memory Bus 512-bit | Memory Bus 128-bit |
Memory Speed 5GT/s | Memory Speed 18GT/s |
Memory Bandwidth 320GB/s | Memory Bandwidth 288GB/s |
TDP 220W | TDP 130W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 1.4 | HDCP HDCP 2.3 |
- | 4x DisplayPort 2.1 |
4x DisplayPort 1.2 | - |
1x SDI | - |
Encoder Model VCE 2.0 | Encoder Model VCN 4.0 |
Decoder Model UVD 4.2 | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 1-Slots |
Height 111 mm (4.37")Width 279 mm (10.98")Depth 37 mm (1.46") | Height 115 mm (4.53")Width 241 mm (9.49")Depth 20 mm (0.79") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Power Connectors 2x 6-Pin | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hawaii | Codename Hotpink Bonefish |
Chip Variant Hawaii Pro | Chip Variant Navi 33 XL |
Market Segment Workstation | Market Segment Workstation |
Release Date Jun 26, 2014 | Release Date Aug 3, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 28nm | Fabrication Node N6 |
Die Size 438mm² | Die Size 204mm² |
Transistor Count 6.2 Billion | Transistor Count 13.3 Billion |
Transistor Density 14.16 MTr/mm² | Transistor Density 65.2 MTr/mm² |
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