GPUs

AMD FirePro W8100 vs AMD Radeon PRO W7700 Full Specs

2,560 Shaders
824MHz
3,072 Shaders
2.6GHz
8GB GDDR5320GB/s
16GB GDDR6576GB/s
··
4.22 TFLOPS
··
31.95 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
220W
TDP
190W
Power Connectors
-
2x 6-Pin
Power Connectors
1x 8-Pin
-

FirePro W8100FirePro W81004.22 TFLOPSFP32
x1
Radeon PRO W7700Radeon PRO W7700127.8 TOPSINT4 Tensor
x30.29

Clock Speed
··
Clock Speed
···
Peak OPS
4.22 TFLOPSFP32
Peak OPS
127.8 TOPSINT4 Tensor
-
Tensor FP16-16
31.95 TFLOPS
Tensor FP16-32
31.95 TFLOPS
-
BF16
63.9 TFLOPS
Tensor BF16
31.95 TFLOPS
FP32
4.22 TFLOPS
FP32
31.95 TFLOPS
FP64
527.4 GFLOPS
FP64
998.4 GFLOPS
Tensor INT4
-
Tensor INT4
127.8 TOPS
-
Tensor INT8
31.95 TOPS
Pixel Rate
52.7 GPixel/s
Pixel Rate
249.6 GPixel/s
Texture Rate
131.8 GTexel/s
Texture Rate
499.2 GTexel/s

Shaders
2,560 Shaders
Shaders
3,072 Shaders
TMUs
160 TMUs
TMUs
192 TMUs
ROPs
64 ROPs
ROPs
96 ROPs
Tensor Cores
-
Tensor Cores
96 T-Cores
RT Cores
-
RT Cores
48 RT-Cores
CUs
40 CUs
CUs
48 CUs

Base Clock
-
Base Clock
1.9GHz
Boost Clock
824MHz
Boost Clock
2.6GHz

L2 Cache
1MB shared
L2 Cache
6.1MB shared
L3 Cache
-
L3 Cache
64MB shared
L3 Bandwidth
-
L3 Bandwidth
2.33TB/s

8GB GDDR5
16GB GDDR6
Memory Bus
512-bit
Memory Bus
256-bit
Memory Speed
5GT/s
Memory Speed
18GT/s
Memory Bandwidth
320GB/s
Memory Bandwidth
576GB/s
ECC
No
ECC
No

TDP
220W
TDP
190W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 1.4
HDCP
HDCP 2.3

-
4x DisplayPort 2.1
4x DisplayPort 1.2
-
1x SDI
-

Encoder Model
VCE 2.0
Encoder Model
VCN 4.0

Decoder Model
UVD 4.2
Decoder Model
VCN 4.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
2-Slots
Height
111 mm (4.37")
Width
279 mm (10.98")
Depth
37 mm (1.46")
Height
111 mm (4.37")
Width
241 mm (9.49")
Depth
40 mm (1.57")
Cooling
Blower
1x Fan
Cooling
Blower
1x Fan
Power Connectors
2x 6-Pin
Power Connectors
1x 8-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
FirePro 2014 branding
Branding
Radeon Pro 2023 branding
Codename
Hawaii
Codename
Wheat Nas
Chip Variant
Hawaii Pro
Chip Variant
Navi 32
Market Segment
Workstation
Market Segment
Workstation
Release Date
Jun 26, 2014
Release Date
Nov 13, 2023

Foundry
TSMC
Foundry
TSMC
Other Foundries
-
Other Foundries
TSMCMCD
Fabrication Node
28nm
-
Fabrication Node
N5
N6MCD
Die Size
438mm²
-
Die Size
200mm²
150mm²MCD
Transistor Count
6.2 Billion
-
Transistor Count
28.1 Billion
8.2 BillionMCD
Transistor Density
14.16 MTr/mm²
-
Transistor Density
140.5 MTr/mm²
54.67 MTr/mm²MCD

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