AMD FirePro W8100 vs NVIDIA GeForce RTX 4060 Full Specs
2,560 Shaders 824MHz | 3,072 Shaders 2.46GHz |
8GB GDDR5320GB/s | 8GB GDDR6288GB/s |
·· 4.22 TFLOPS | ·· 15.11 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 220W | TDP 115W |
Power Connectors - 2x 6-Pin | Power Connectors 1x 16-Pin 12VHPWR - |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 4.22 TFLOPSFP32 | Peak OPS 483.7 TOPSINT4 Tensor Sparse |
- | Tensor FP8-16 120.9 TFLOPSFP8-16 Tensor Sparse 241.8 TFLOPSTensor FP8-32 60.46 TFLOPSFP8-32 Tensor Sparse 120.9 TFLOPS |
- | Tensor FP16-16 60.46 TFLOPSFP16-16 Tensor Sparse 120.9 TFLOPSTensor FP16-32 30.23 TFLOPSFP16-32 Tensor Sparse 60.46 TFLOPS |
- | BF16 15.11 TFLOPSTensor BF16 30.23 TFLOPSBF16 Tensor Sparse 60.46 TFLOPS |
Tensor TF32 - | Tensor TF32 15.11 TFLOPS |
FP32 4.22 TFLOPS | FP32 15.11 TFLOPS |
FP64 527.4 GFLOPS | FP64 236.2 GFLOPS |
Tensor INT4 - | Tensor INT4 241.8 TOPS |
- | Tensor INT8 120.9 TOPS |
Ray - | Ray 34.94 TOPS |
Pixel Rate 52.7 GPixel/s | Pixel Rate 118.1 GPixel/s |
Texture Rate 131.8 GTexel/s | Texture Rate 236.2 GTexel/s |
Shaders 2,560 Shaders | Shaders 3,072 Shaders |
TMUs 160 TMUs | TMUs 96 TMUs |
ROPs 64 ROPs | ROPs 48 ROPs |
Tensor Cores - | Tensor Cores 96 T-Cores |
RT Cores - | RT Cores 24 RT-Cores |
CUs 40 CUs | SMs 24 SMs |
Base Clock - | Base Clock 1.83GHz |
Boost Clock 824MHz | Boost Clock 2.46GHz |
L2 Cache 1MB shared | L2 Cache 49.1MB shared |
8GB GDDR5 | 8GB GDDR6 |
Memory Bus 512-bit | Memory Bus 128-bit |
Memory Speed 5GT/s | Memory Speed 18GT/s |
Memory Bandwidth 320GB/s | Memory Bandwidth 288GB/s |
TDP 220W | TDP 115W |
Max Temp - | Max Temp 90°C Max |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 1.4 | HDCP HDCP 2.3 |
- | 3x DisplayPort 1.4 |
4x DisplayPort 1.2 | - |
- | 1x HDMI 2.1 |
1x SDI | - |
Encoder Model VCE 2.0 | Encoder Model NVENC 8 |
Decoder Model UVD 4.2 | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2.1-Slots |
Height 111 mm (4.37")Width 279 mm (10.98")Depth 37 mm (1.46") | Height 98 mm (3.86")Width 244 mm (9.61")Depth 42 mm (1.65") |
Cooling Blower 1x Fan | Cooling Open-Air 2x Fans |
Power Connectors 2x 6-Pin | Power Connectors 1x 16-Pin 12VHPWR |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Hawaii | Codename NV187 |
Chip Variant Hawaii Pro | Chip Variant AD107 |
Market Segment Workstation | Market Segment Desktop |
Release Date Jun 26, 2014 | Release Date May 18, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 28nm | Fabrication Node 4N |
Die Size 438mm² | Die Size 159mm² |
Transistor Count 6.2 Billion | Transistor Count 18.9 Billion |
Transistor Density 14.16 MTr/mm² | Transistor Density 118.9 MTr/mm² |
No images available
No images available
Desktops - | Desktops |



