AMD Mobility FireGL V5700 vs AMD Mobility FireGL V5725 Full Specs
120 Shaders 600MHz | 120 Shaders 680MHz |
524MB GDDR322.4GB/s | 262MB GDDR325.6GB/s |
·· 144 GFLOPS | ·· 163.2 GFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 27W | TDP 27W |
Mobility FireGL V5700144 GFLOPSFP32Mobility FireGL V5725163.2 GFLOPSFP32Clock Speed ·· | Clock Speed ·· |
Peak OPS 144 GFLOPSFP32 | Peak OPS 163.2 GFLOPSFP32 |
FP32 144 GFLOPS | FP32 163.2 GFLOPS |
Pixel Rate 2.4 GPixel/s | Pixel Rate 2.7 GPixel/s |
Texture Rate 4.8 GTexel/s | Texture Rate 5.4 GTexel/s |
Shaders 120 Shaders | Shaders 120 Shaders |
TMUs 8 TMUs | TMUs 8 TMUs |
ROPs 4 ROPs | ROPs 4 ROPs |
CUs 3 CUs | CUs 3 CUs |
Boost Clock 600MHz | Boost Clock 680MHz |
L2 Cache 128KB shared | L2 Cache 128KB shared |
524MB GDDR3 | 262MB GDDR3 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 1.4GT/s | Memory Speed 1.6GT/s |
Memory Bandwidth 22.4GB/s | Memory Bandwidth 25.6GB/s |
TDP 27W | TDP 27W |
Multi-Monitor 2 | Multi-Monitor 2 |
Decoder Model UVD 1.0 | Decoder Model UVD 1.0 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding |
Codename Wario | Codename Wario |
Chip Variant RV635 Pro | Chip Variant RV635 Pro |
Market Segment Laptop | Market Segment Laptop |
Release Date Jan 7, 2008 | Release Date Jan 1, 2009 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 55nm | Fabrication Node 55nm |
Die Size 153mm² | Die Size 153mm² |
Transistor Count 378 Million | Transistor Count 378 Million |
Transistor Density 2.47 MTr/mm² | Transistor Density 2.47 MTr/mm² |
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