GPUs

AMD Radeon 740M 2800MHz vs Apple 10-Core M4 Full Specs

256 Shaders
2.8GHz
1,280 Shaders
1.58GHz
Shared Memory120GB/s
·
Shared Memory120GB/sLPDDR5X
··
1.43 TFLOPS
··
4.04 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon 740M 2800MHzRadeon 740M 2800MHz2.87 TFLOPSFP16
x1
10-Core M410-Core M44.04 TFLOPSFP16
x1.41

Clock Speed
···
Clock Speed
··
Peak OPS
2.87 TFLOPSFP16
Peak OPS
4.04 TFLOPSFP16
BF16
2.87 TFLOPS
-
FP32
1.43 TFLOPS
FP32
4.04 TFLOPS
FP64
89.6 GFLOPS
-
Pixel Rate
22.4 GPixel/s
Pixel Rate
63.1 GPixel/s
Texture Rate
44.8 GTexel/s
Texture Rate
126.2 GTexel/s

Shaders
256 Shaders
Shaders
1,280 Shaders
TMUs
16 TMUs
TMUs
80 TMUs
ROPs
8 ROPs
ROPs
40 ROPs
RT Cores
4 RT-Cores
RT Cores
10 RT-Cores
CUs
4 CUs
EUs
160 EUs

Base Clock
1.5GHz
Base Clock
-
Boost Clock
2.8GHz
Boost Clock
1.58GHz

L2 Cache
-
L2 Cache
2MB shared

Shared Memory
·
Shared MemoryLPDDR5X
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
7.5GT/s
Memory Speed
7.5GT/s
Memory Bandwidth
120GB/s
Memory Bandwidth
120GB/s
ECC
No
ECC
No

Multi-Monitor
4
Multi-Monitor
2
HDCP
HDCP 2.2
HDCP
-

Encoder Model
VCN 4.0
Encoder Model
Apple Media Engine 3

Decoder Model
VCN 4.0
Decoder Model
Apple Media Engine 3

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
M4 branding
Codename
Phoenix
Codename
G16G
Market Segment
Laptop
Market Segment
Laptop
Release Date
May 5, 2023
Release Date
Oct 28, 2024

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4
Fabrication Node
N3E
Die Size
137mm²
Die Size
169mm²
Transistor Count
20.9 Billion
Transistor Count
28 Billion
Transistor Density
153 MTr/mm²
Transistor Density
165 MTr/mm²

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