GPUs

AMD Radeon 740M 2800MHz vs Intel Graphics 2C 2300MHz Full Specs

256 Shaders
2.8GHz
256 Shaders
2.3GHz
Shared Memory120GB/s
·
Shared Memory119.5GB/s
·
··
1.43 TFLOPS
··
1.18 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon 740M 2800MHzRadeon 740M 2800MHz2.87 TFLOPSFP16
x1
Graphics 2C 2300MHzGraphics 2C 2300MHz37.68 TOPSINT4 Tensor
x13.14

Clock Speed
···
Clock Speed
··
Peak OPS
2.87 TFLOPSFP16
Peak OPS
37.68 TOPSINT4 Tensor
-
Tensor FP16-32
9.42 TFLOPS
BF16
2.87 TFLOPS
Tensor BF16
-
BF16
-
Tensor BF16
9.42 TFLOPS
FP32
1.43 TFLOPS
FP32
1.18 TFLOPS
FP64
89.6 GFLOPS
FP64
294.4 GFLOPS
Tensor INT4
-
Tensor INT4
37.68 TOPS
-
Tensor INT8
18.84 TOPS
Pixel Rate
22.4 GPixel/s
Pixel Rate
18.4 GPixel/s
Texture Rate
44.8 GTexel/s
Texture Rate
36.8 GTexel/s

Shaders
256 Shaders
Shaders
256 Shaders
TMUs
16 TMUs
TMUs
16 TMUs
ROPs
8 ROPs
ROPs
8 ROPs
Tensor Cores
-
Tensor Cores
16 T-Cores
RT Cores
4 RT-Cores
RT Cores
2 RT-Cores
CUs
4 CUs
EUs
16 EUs

Base Clock
1.5GHz
Base Clock
-
Boost Clock
2.8GHz
Boost Clock
2.3GHz

L2 Cache
-
L2 Cache
4.1MB shared

Shared Memory
·
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
7.5GT/s
Memory Speed
7.5GT/s
Memory Bandwidth
120GB/s
Memory Bandwidth
119.5GB/s

Multi-Monitor
4
Multi-Monitor
3
HDCP
HDCP 2.2
HDCP
-

Encoder Model
VCN 4.0
Encoder Model
Xe Media Engine

Decoder Model
VCN 4.0
Decoder Model
Xe Media Engine

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
Graphics 2024 branding
Codename
Phoenix
Codename
Xe3 LPG
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
May 5, 2023
Release Date
Jan 5, 2026

Foundry
TSMC
Foundry
Intel
Fabrication Node
N4
Fabrication Node
Intel 3
Die Size
137mm²
Die Size
27mm²
Transistor Count
20.9 Billion
Transistor Count
-
Transistor Density
153 MTr/mm²
Transistor Density
-

No images available
No images available