AMD Radeon 740M 2800MHz vs Intel Graphics 4C 2300MHz Full Specs

Summary

256 Shaders 2.8GHz	512 Shaders 2.3GHz
Shared Memory120GB/s LPDDR5X·DDR5	Shared Memory136.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 1.43 TFLOPS	Peak·FP32·FP16 2.35 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 BF16 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth

Radeon 740M 2800MHz2.87 TFLOPSFP16

x1

Graphics 4C 2300MHz75.37 TOPSINT4 Tensor

x26.29

Show Top Score

Theoretical Performance

Clock Speed2800MHz UC·Base·Boost·OC	Clock Speed2300MHz UC·Boost·OC
Peak OPS 2.87 TFLOPSFP16	Peak OPS 75.37 TOPSINT4 Tensor
-	Tensor FP16-32 18.84 TFLOPS
BF16 2.87 TFLOPS Tensor BF16 -	BF16 - Tensor BF16 18.84 TFLOPS
FP32 1.43 TFLOPS	FP32 2.35 TFLOPS
FP64 89.6 GFLOPS	FP64 588.8 GFLOPS
Tensor INT4 -	Tensor INT4 75.37 TOPS
-	Tensor INT8 37.68 TOPS
Pixel Rate 22.4 GPixel/s	Pixel Rate 36.8 GPixel/s
Texture Rate 44.8 GTexel/s	Texture Rate 73.6 GTexel/s

Core Config

Shaders 256 Shaders	Shaders 512 Shaders
TMUs 16 TMUs	TMUs 32 TMUs
ROPs 8 ROPs	ROPs 16 ROPs
Tensor Cores -	Tensor Cores 32 T-Cores
RT Cores 4 RT-Cores	RT Cores 4 RT-Cores
CUs 4 CUs	EUs 32 EUs

Clocks

Base Clock 1.5GHz	Base Clock -
Boost Clock 2.8GHz	Boost Clock 2.3GHz

Cache

L2 Cache -

L2 Cache 4.1MB shared

Memory

Shared Memory LPDDR5X·DDR5	Shared Memory LPDDR5X·DDR5
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 7.5GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 120GB/s	Memory Bandwidth 136.5GB/s

Video Output

Multi-Monitor 4	Multi-Monitor 3
HDCP HDCP 2.2	HDCP -

Encoder

Encoder Model VCN 4.0

Encoder Model Xe Media Engine

Decoder

Decoder Model VCN 4.0

Decoder Model Xe Media Engine

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer AMD	Manufacturer Intel
Chip Designer AMD	Chip Designer Intel
Architecture RDNA 3	Architecture Battlemage
Family 700	Family Gen 13
Branding	Branding
Codename Phoenix	Codename Xe3 LPG
Chip Variant -	Chip Variant GT1
Market Segment Laptop	Market Segment Laptop
Release Date May 5, 2023	Release Date Jan 5, 2026

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N4	Fabrication Node Intel 3
Die Size 137mm²	Die Size 27mm²
Transistor Count 20.9 Billion	Transistor Count -
Transistor Density 153 MTr/mm²	Transistor Density -

Images

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Used In

CPUs Ryzen 5 7545U Ryzen 5 8540U Ryzen 5 220 Show 6 more

CPUs Core Ultra 5 336H

Competitors

AMDRadeon 740M 2800MHz vs GPU IntelGraphics 2C 2300MHz AMDRadeon 740M 2800MHz vs GPU AMDRadeon 840M 2900MHz AMDRadeon 740M 2800MHz vs GPU AMDRadeon 860M 3000MHz Show 4 more

IntelGraphics 4C 2300MHz vs GPU IntelGraphics 4C 2450MHz IntelGraphics 4C 2300MHz vs GPU IntelGraphics 4C 2500MHz IntelGraphics 4C 2300MHz vs GPU AMDRadeon 860M 3000MHz Show 12 more