GPUs

AMD Radeon 840M 2900MHz vs Intel Arc 130V 1850MHz Full Specs

256 Shaders
2.9GHz
896 Shaders
1.85GHz
Shared Memory128GB/s
·
Shared Memory136.5GB/sLPDDR5X
··
1.49 TFLOPS
··
3.31 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon 840M 2900MHzRadeon 840M 2900MHz2.97 TFLOPSFP16
x1
Arc 130V 1850MHzArc 130V 1850MHz106.1 TOPSINT4 Tensor
x35.72

Clock Speed
···
Clock Speed
··
Peak OPS
2.97 TFLOPSFP16
Peak OPS
106.1 TOPSINT4 Tensor
-
Tensor FP16-32
26.52 TFLOPS
BF16
2.97 TFLOPS
Tensor BF16
-
BF16
-
Tensor BF16
26.52 TFLOPS
FP32
1.49 TFLOPS
FP32
3.31 TFLOPS
FP64
92.8 GFLOPS
FP64
828.8 GFLOPS
Tensor INT4
-
Tensor INT4
106.1 TOPS
-
Tensor INT8
53.04 TOPS
Pixel Rate
92.8 GPixel/s
Pixel Rate
51.8 GPixel/s
Texture Rate
46.4 GTexel/s
Texture Rate
103.6 GTexel/s

Shaders
256 Shaders
Shaders
896 Shaders
TMUs
16 TMUs
TMUs
56 TMUs
ROPs
32 ROPs
ROPs
28 ROPs
Tensor Cores
-
Tensor Cores
56 T-Cores
RT Cores
4 RT-Cores
RT Cores
7 RT-Cores
CUs
4 CUs
EUs
56 EUs

Base Clock
1.5GHz
Base Clock
-
Boost Clock
2.9GHz
Boost Clock
1.85GHz

L2 Cache
-
L2 Cache
7.2MB shared

Shared Memory
·
Shared MemoryLPDDR5X
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
8GT/s
Memory Speed
8.5GT/s
Memory Bandwidth
128GB/s
Memory Bandwidth
136.5GB/s

Multi-Monitor
4
Multi-Monitor
3
HDCP
HDCP 2.3
HDCP
-

Encoder Model
VCN 4.0
Encoder Model
Xe Media Engine

Decoder Model
VCN 4.0
Decoder Model
Xe Media Engine

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
Arc branding
Codename
Strix Point
Codename
Xe2 LPG
Chip Variant
-
Chip Variant
GT2
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 6, 2025
Release Date
Sep 3, 2024

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4P
Fabrication Node
N3B
Die Size
233mm²
Die Size
140mm²
Transistor Count
28 Billion
Transistor Count
-
Transistor Density
120 MTr/mm²
Transistor Density
-

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