GPUs

AMD Radeon 840M 2900MHz vs Intel Iris Xe 96EU 950MHz Full Specs

256 Shaders
2.9GHz
768 Shaders
950MHz
Shared Memory128GB/s
·
Shared Memory
··
1.49 TFLOPS
··
1.46 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon 840M 2900MHzRadeon 840M 2900MHz2.97 TFLOPSFP16
x1.02
Iris Xe 96EU 950MHzIris Xe 96EU 950MHz2.92 TFLOPSFP16
x1

Clock Speed
···
Clock Speed
···
Peak OPS
2.97 TFLOPSFP16
Peak OPS
2.92 TFLOPSFP16
BF16
2.97 TFLOPS
-
FP32
1.49 TFLOPS
FP32
1.46 TFLOPS
FP64
92.8 GFLOPS
FP64
364.8 GFLOPS
Pixel Rate
92.8 GPixel/s
Pixel Rate
5.7 GPixel/s
Texture Rate
46.4 GTexel/s
Texture Rate
91.2 GTexel/s

Shaders
256 Shaders
Shaders
768 Shaders
TMUs
16 TMUs
TMUs
96 TMUs
ROPs
32 ROPs
ROPs
6 ROPs
RT Cores
4 RT-Cores
RT Cores
-
CUs
4 CUs
EUs
96 EUs

Base Clock
1.5GHz
Base Clock
300MHz
Boost Clock
2.9GHz
Boost Clock
950MHz

L2 Cache
-
L2 Cache
1MB shared
L3 Cache
-
L3 Cache
4MB shared

Shared Memory
·
Shared Memory
Memory Bus
128-bit
Memory Bus
-
Memory Speed
8GT/s
Memory Speed
-
Memory Bandwidth
128GB/s
Memory Bandwidth
-
ECC
No
ECC
No

Multi-Monitor
4
Multi-Monitor
4
HDCP
HDCP 2.3
HDCP
-

Encoder Model
VCN 4.0
Encoder Model
Quick Sync Video 8

Decoder Model
VCN 4.0
Decoder Model
Quick Sync Video 8

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
Iris Xe branding
Codename
Strix Point
Codename
Xe LP
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 6, 2025
Release Date
Mar 30, 2021

Foundry
TSMC
Foundry
-
Fabrication Node
N4P
Fabrication Node
-
Die Size
233mm²
Die Size
-
Transistor Count
28 Billion
Transistor Count
-
Transistor Density
120 MTr/mm²
Transistor Density
-

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