GPUs

AMD Radeon 840M 2900MHz vs NVIDIA GeForce MX330 Full Specs

256 Shaders
2.9GHz
384 Shaders
1.59GHz
Shared Memory128GB/s
·
2GB GDDR556GB/s
··
1.49 TFLOPS
··
1.22 TFLOPS
Form Factor
iGPU
Form Factor
Soldered
TDP
Shared
TDP
25W

Radeon 840M 2900MHzRadeon 840M 2900MHz2.97 TFLOPSFP16
x2.43
GeForce MX330GeForce MX3301.22 TFLOPSFP32
x1

Clock Speed
···
Clock Speed
···
Peak OPS
2.97 TFLOPSFP16
Peak OPS
1.22 TFLOPSFP32
BF16
2.97 TFLOPS
-
FP32
1.49 TFLOPS
FP32
1.22 TFLOPS
FP64
92.8 GFLOPS
FP64
38.26 GFLOPS
Pixel Rate
92.8 GPixel/s
Pixel Rate
25.5 GPixel/s
Texture Rate
46.4 GTexel/s
Texture Rate
38.3 GTexel/s

Shaders
256 Shaders
Shaders
384 Shaders
TMUs
16 TMUs
TMUs
24 TMUs
ROPs
32 ROPs
ROPs
16 ROPs
RT Cores
4 RT-Cores
RT Cores
-
CUs
4 CUs
SMs
3 SMs

Base Clock
1.5GHz
Base Clock
1.53GHz
Boost Clock
2.9GHz
Boost Clock
1.59GHz

L2 Cache
-
L2 Cache
512KB shared

Shared Memory
·
2GB GDDR5
Memory Bus
128-bit
Memory Bus
64-bit
Memory Speed
8GT/s
Memory Speed
7GT/s
Memory Bandwidth
128GB/s
Memory Bandwidth
56GB/s

TDP
Shared
TDP
25W

Multi-Monitor
4
Multi-Monitor
2
HDCP
HDCP 2.3
HDCP
HDCP 2.2

Encoder Model
VCN 4.0
-

Decoder Model
VCN 4.0
Decoder Model
NVDEC 3

Form Factor
iGPU
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
GeForce MX branding
Codename
Strix Point
Codename
NV138
Chip Variant
-
Chip Variant
GP108-200-A1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 6, 2025
Release Date
Feb 12, 2020

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N4P
Fabrication Node
14LPP
Die Size
233mm²
Die Size
74mm²
Transistor Count
28 Billion
Transistor Count
1.8 Billion
Transistor Density
120 MTr/mm²
Transistor Density
24.32 MTr/mm²

No images available
No images available