AMD Radeon Pro SSG vs NVIDIA Quadro P2000 Laptop Full Specs

Summary

4,096 Shaders 1.05GHz	768 Shaders 1.61GHz
4GB HBM512GB/s	5GB GDDR596GB/s
Peak·FP32·FP16 8.6 TFLOPS	Peak·FP32·FP16 2.47 TFLOPS
Form Factor PCIe Card	Form Factor Soldered
TDP 200W	TDP 50W
Power Connectors 1x 8-Pin 1x 6-Pin	Power Connectors -

Highlights

Peak OPS

Peak OPS FP32 FP16 FP64 Memory Bandwidth TDP

Radeon Pro SSG8.6 TFLOPSFP32

x3.48

Quadro P2000 Laptop2.47 TFLOPSFP32

x1

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Theoretical Performance

Clock Speed1050MHz UC·Boost·OC	Clock Speed1607MHz UC·Base·Boost·OC
Peak OPS 8.6 TFLOPSFP32	Peak OPS 2.47 TFLOPSFP32
FP32 8.6 TFLOPS	FP32 2.47 TFLOPS
FP64 537.6 GFLOPS	FP64 77.14 GFLOPS
Pixel Rate 67.2 GPixel/s	Pixel Rate 51.4 GPixel/s
Texture Rate 268.8 GTexel/s	Texture Rate 102.9 GTexel/s

Core Config

Shaders 4,096 Shaders	Shaders 768 Shaders
TMUs 256 TMUs	TMUs 64 TMUs
ROPs 64 ROPs	ROPs 32 ROPs
CUs 64 CUs	SMs 6 SMs

Clocks

Base Clock -	Base Clock 1.56GHz
Boost Clock 1.05GHz	Boost Clock 1.61GHz

Cache

L2 Cache 2MB shared

L2 Cache 1MB shared

Memory

4GB HBM	5GB GDDR5
Memory Bus 4096-bit	Memory Bus 128-bit
Memory Speed 1GT/s	Memory Speed 6GT/s
Memory Bandwidth 512GB/s	Memory Bandwidth 96GB/s
ECC No	ECC No
SSG Supported	SSG -

Power & Thermals

TDP 200W

TDP 50W

Video Output

Multi-Monitor 4	Multi-Monitor 3
HDCP HDCP 1.4	HDCP -

Ports

3x DisplayPort 1.2	-
1x HDMI 1.4	-

Encoder

Encoder Model VCE 3.0

Encoder Model NVENC 4

Decoder

Decoder Model UVD 6.0

Decoder Model NVDEC 3

Card

Form Factor PCIe Card	Form Factor Soldered
PCIe 2-Slots	PCIe -
Height 111 mm (4.37") Width 267 mm (10.51") Depth 37 mm (1.46")	-
Cooling Blower 1x Fan	Cooling Open-Air -
Power Connectors 1x 8-Pin, 1x 6-Pin	Power Connectors -

Chip

Manufacturer AMD	Manufacturer NVIDIA
Chip Designer AMD	Chip Designer NVIDIA
Architecture GCN 3	Architecture Pascal
Family Radeon Pro	Family Quadro P
Branding	Branding
Codename Fiji	Codename NV137
Chip Variant Fiji Pro	Chip Variant GP107-300-A1
Market Segment Workstation	Market Segment Laptop
Release Date Jul 26, 2016	Release Date Feb 6, 2017

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node 28nm	Fabrication Node 14LPP
Die Size 596mm²	Die Size 132mm²
Transistor Count 8.9 Billion	Transistor Count 3.3 Billion
Transistor Density 14.93 MTr/mm²	Transistor Density 25 MTr/mm²

Images

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