AMD Radeon PRO W7400 vs Apple FirePro D500 Full Specs

Summary

1,792 Shaders 1.1GHz	1,536 Shaders 725MHz
8GB GDDR6172.8GB/s	3GB GDDR5243.8GB/s
Peak·FP32·FP16 7.88 TFLOPS	Peak·FP32·FP16 2.23 TFLOPS
Form Factor PCIe Card	Form Factor Mac Pro Card
TDP 55W	TDP 220W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-16 Tensor FP16-32 FP64 BF16 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Radeon PRO W740031.54 TOPSINT4 Tensor

x14.16

FirePro D5002.23 TFLOPSFP32

x1

Show Top Score

Theoretical Performance

Clock Speed1100MHz UC·Base·Boost·OC	Clock Speed725MHz UC·Boost·OC
Peak OPS 31.54 TOPSINT4 Tensor	Peak OPS 2.23 TFLOPSFP32
Tensor FP16-16 7.88 TFLOPS Tensor FP16-32 7.88 TFLOPS	-
BF16 15.77 TFLOPS Tensor BF16 7.88 TFLOPS	-
FP32 7.88 TFLOPS	FP32 2.23 TFLOPS
FP64 246.4 GFLOPS	FP64 556.8 GFLOPS
Tensor INT4 31.54 TOPS	Tensor INT4 -
Tensor INT8 7.88 TOPS	-
Pixel Rate 70.4 GPixel/s	Pixel Rate 23.2 GPixel/s
Texture Rate 123.2 GTexel/s	Texture Rate 69.6 GTexel/s

Core Config

Shaders 1,792 Shaders	Shaders 1,536 Shaders
TMUs 112 TMUs	TMUs 96 TMUs
ROPs 64 ROPs	ROPs 32 ROPs
Tensor Cores 56 T-Cores	Tensor Cores -
RT Cores 28 RT-Cores	RT Cores -
CUs 28 CUs	CUs 24 CUs

Clocks

Base Clock 1GHz	Base Clock -
Boost Clock 1.1GHz	Boost Clock 725MHz

Cache

L2 Cache 2MB shared	L2 Cache 768KB shared
L3 Cache 32MB shared	L3 Cache -
L3 Bandwidth 1.17TB/s	L3 Bandwidth -

Memory

8GB GDDR6	3GB GDDR5
Memory Bus 128-bit	Memory Bus 384-bit
Memory Speed 10.8GT/s	Memory Speed 5.1GT/s
Memory Bandwidth 172.8GB/s	Memory Bandwidth 243.8GB/s
ECC No	ECC No

Power & Thermals

TDP 55W

TDP 220W

Video Output

Multi-Monitor 3	Multi-Monitor 6
HDCP HDCP 2.3	HDCP -

Ports

4x DisplayPort 2.1

-

Encoder

Encoder Model VCN 4.0

Encoder Model VCE 1.0

Decoder

Decoder Model VCN 4.0

Decoder Model UVD 3.2

Card

Form Factor PCIe Card	Form Factor Mac Pro Card
PCIe 1-Slots	PCIe -
Height 115 mm (4.53") Width 216 mm (8.5") Depth 20 mm (0.79")	-
Cooling Blower 1x Fan	Cooling Passive -

Chip

Manufacturer AMD	Manufacturer Apple
Chip Designer AMD	Chip Designer AMD
Architecture RDNA 3	Architecture GCN 1
Family Radeon PRO W	Family FirePro D
Branding	Branding
Codename Hotpink Bonefish	Codename Tahiti
Chip Variant Navi 33 XL	Chip Variant Tahiti LE
Market Segment Workstation	Market Segment Workstation
Release Date Aug 7, 2025	Release Date Jan 18, 2014

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node 28nm
Die Size 204mm²	Die Size 352mm²
Transistor Count 13.3 Billion	Transistor Count 4.3 Billion
Transistor Density 65.2 MTr/mm²	Transistor Density 12.25 MTr/mm²

Images

No images available

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Used In

Desktops -

Desktops Mac Pro(Late 2013)

Competitors

AMDRadeon PRO W7400 vs GPU AMDRadeon PRO W7500 AMDRadeon PRO W7400 vs GPU AMDRadeon RX 7400 AMDRadeon PRO W7400 vs GPU AMDRadeon PRO W7600 Show 12 more

AppleFirePro D500 vs GPU AMDRadeon PRO W7600 AppleFirePro D500 vs GPU AMDRadeon RX 9060 AppleFirePro D500 vs GPU AMDRadeon PRO W7500 Show 11 more