AMD Radeon PRO W7400 vs ATI FireMV 2260 Full Specs

Summary

1,792 Shaders 1.1GHz	40 Shaders 600MHz
8GB GDDR6172.8GB/s	262MB DDR232GB/s
Peak·FP32·FP16 7.88 TFLOPS	Peak·FP32·FP16 48 GFLOPS
Form Factor PCIe Card	Form Factor PCIe Card
TDP 55W	TDP 32W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-16 Tensor FP16-32 FP64 BF16 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Radeon PRO W740031.54 TOPSINT4 Tensor

x657.07

FireMV 226048 GFLOPSFP32

x1

Show Top Score

Theoretical Performance

Clock Speed1100MHz UC·Base·Boost·OC	Clock Speed600MHz UC·Boost·OC
Peak OPS 31.54 TOPSINT4 Tensor	Peak OPS 48 GFLOPSFP32
Tensor FP16-16 7.88 TFLOPS Tensor FP16-32 7.88 TFLOPS	-
BF16 15.77 TFLOPS Tensor BF16 7.88 TFLOPS	-
FP32 7.88 TFLOPS	FP32 48 GFLOPS
FP64 246.4 GFLOPS	-
Tensor INT4 31.54 TOPS	Tensor INT4 -
Tensor INT8 7.88 TOPS	-
Pixel Rate 70.4 GPixel/s	Pixel Rate 2.4 GPixel/s
Texture Rate 123.2 GTexel/s	Texture Rate 2.4 GTexel/s

Core Config

Shaders 1,792 Shaders	Shaders 40 Shaders
TMUs 112 TMUs	TMUs 4 TMUs
ROPs 64 ROPs	ROPs 4 ROPs
Tensor Cores 56 T-Cores	Tensor Cores -
RT Cores 28 RT-Cores	RT Cores -
CUs 28 CUs	CU 1 CU

Clocks

Base Clock 1GHz	Base Clock -
Boost Clock 1.1GHz	Boost Clock 600MHz

Cache

L2 Cache 2MB shared	L2 Cache 64KB shared
L3 Cache 32MB shared	L3 Cache -
L3 Bandwidth 1.17TB/s	L3 Bandwidth -

Memory

8GB GDDR6	262MB DDR2
Memory Bus 128-bit	Memory Bus 256-bit
Memory Speed 10.8GT/s	Memory Speed 1GT/s
Memory Bandwidth 172.8GB/s	Memory Bandwidth 32GB/s
ECC No	ECC No

Power & Thermals

TDP 55W

TDP 32W

Video Output

Multi-Monitor 3	Multi-Monitor 2
HDCP HDCP 2.3	HDCP -

Ports

4x DisplayPort 2.1	-
-	2x DisplayPort 1.0

Encoder

Encoder Model VCN 4.0

-

Decoder

Decoder Model VCN 4.0

Decoder Model UVD 1.0

Card

Form Factor PCIe Card	Form Factor PCIe Card
PCIe 1-Slots	PCIe 1-Slots
Height 115 mm (4.53") Width 216 mm (8.5") Depth 20 mm (0.79")	-
Cooling Blower 1x Fan	Cooling Passive -

Chip

Manufacturer AMD	Manufacturer ATI
Chip Designer AMD	Chip Designer ATI
Architecture RDNA 3	Architecture TeraScale 1
Family Radeon PRO W	Family FireMV
Branding	Branding
Codename Hotpink Bonefish	Codename Koopa
Chip Variant Navi 33 XL	Chip Variant RV620 LE
Market Segment Workstation	Market Segment Workstation
Release Date Aug 7, 2025	Release Date Jan 1, 2008

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node 55nm
Die Size 204mm²	Die Size 67mm²
Transistor Count 13.3 Billion	Transistor Count 181 Million
Transistor Density 65.2 MTr/mm²	Transistor Density 2.7 MTr/mm²

Images

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Competitors

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