AMD Radeon PRO W7400 vs ATI FirePro 3D V7800 Full Specs
1,792 Shaders 1.1GHz | 1,440 Shaders 700MHz |
8GB GDDR6172.8GB/s | 2GB GDDR5128GB/s |
·· 7.88 TFLOPS | ·· 2.02 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 55W | TDP 138W |
Power Connectors - | Power Connectors 1x 6-Pin |
Radeon PRO W740031.54 TOPSINT4 Tensor
FirePro 3D V78002.02 TFLOPSFP32Clock Speed ··· | Clock Speed ·· |
Peak OPS 31.54 TOPSINT4 Tensor | Peak OPS 2.02 TFLOPSFP32 |
Tensor FP16-16 7.88 TFLOPSTensor FP16-32 7.88 TFLOPS | - |
BF16 15.77 TFLOPSTensor BF16 7.88 TFLOPS | - |
FP32 7.88 TFLOPS | FP32 2.02 TFLOPS |
FP64 246.4 GFLOPS | FP64 403.2 GFLOPS |
Tensor INT4 31.54 TOPS | Tensor INT4 - |
Tensor INT8 7.88 TOPS | - |
Pixel Rate 70.4 GPixel/s | Pixel Rate 22.4 GPixel/s |
Texture Rate 123.2 GTexel/s | Texture Rate 50.4 GTexel/s |
Shaders 1,792 Shaders | Shaders 1,440 Shaders |
TMUs 112 TMUs | TMUs 72 TMUs |
ROPs 64 ROPs | ROPs 32 ROPs |
Tensor Cores 56 T-Cores | Tensor Cores - |
RT Cores 28 RT-Cores | RT Cores - |
CUs 28 CUs | CUs 18 CUs |
Base Clock 1GHz | Base Clock - |
Boost Clock 1.1GHz | Boost Clock 700MHz |
L2 Cache 2MB shared | L2 Cache 512KB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.17TB/s | L3 Bandwidth - |
8GB GDDR6 | 2GB GDDR5 |
Memory Bus 128-bit | Memory Bus 256-bit |
Memory Speed 10.8GT/s | Memory Speed 4GT/s |
Memory Bandwidth 172.8GB/s | Memory Bandwidth 128GB/s |
TDP 55W | TDP 138W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP - |
4x DisplayPort 2.1 | - |
- | 2x DisplayPort 1.1 |
- | 1x DVI-I Dual-Link |
Encoder Model VCN 4.0 | - |
Decoder Model VCN 4.0 | Decoder Model UVD 2.2 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 1-Slots |
Height 115 mm (4.53")Width 216 mm (8.5")Depth 20 mm (0.79") | Height 111 mm (4.37")Width 254 mm (10")Depth 20 mm (0.79") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Power Connectors - | Power Connectors 1x 6-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hotpink Bonefish | Codename Cypress |
Chip Variant Navi 33 XL | Chip Variant Cypress LE |
Market Segment Workstation | Market Segment Workstation |
Release Date Aug 7, 2025 | Release Date Apr 26, 2010 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node 40nm |
Die Size 204mm² | Die Size 334mm² |
Transistor Count 13.3 Billion | Transistor Count 2.2 Billion |
Transistor Density 65.2 MTr/mm² | Transistor Density 6.45 MTr/mm² |
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