AMD Radeon PRO W7600 vs Apple Radeon Pro 580X MPX Full Specs
2,048 Shaders 2.44GHz | 2,304 Shaders 1.22GHz |
8GB GDDR6288GB/s | 8GB GDDR5218.9GB/s |
·· 19.99 TFLOPS | ·· 5.62 TFLOPS |
Form Factor PCIe Card | Form Factor MPX |
TDP 130W | TDP 185W |
Power Connectors 1x 8-Pin | Power Connectors - |
Radeon PRO W760079.95 TOPSINT4 Tensor
Radeon Pro 580X MPX5.62 TFLOPSFP16Clock Speed ··· | Clock Speed ··· |
Peak OPS 79.95 TOPSINT4 Tensor | Peak OPS 5.62 TFLOPSFP16 |
Tensor FP16-16 19.99 TFLOPSTensor FP16-32 19.99 TFLOPS | - |
BF16 39.98 TFLOPSTensor BF16 19.99 TFLOPS | - |
FP32 19.99 TFLOPS | FP32 5.62 TFLOPS |
FP64 624.6 GFLOPS | FP64 351.4 GFLOPS |
Tensor INT4 79.95 TOPS | Tensor INT4 - |
Tensor INT8 19.99 TOPS | - |
Pixel Rate 156.2 GPixel/s | Pixel Rate 39 GPixel/s |
Texture Rate 312.3 GTexel/s | Texture Rate 175.7 GTexel/s |
Shaders 2,048 Shaders | Shaders 2,304 Shaders |
TMUs 128 TMUs | TMUs 144 TMUs |
ROPs 64 ROPs | ROPs 32 ROPs |
Tensor Cores 64 T-Cores | Tensor Cores - |
RT Cores 32 RT-Cores | RT Cores - |
CUs 32 CUs | CUs 36 CUs |
Base Clock 1.72GHz | Base Clock 1.1GHz |
Boost Clock 2.44GHz | Boost Clock 1.22GHz |
L2 Cache 2MB shared | L2 Cache 2MB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.17TB/s | L3 Bandwidth - |
8GB GDDR6 | 8GB GDDR5 |
Memory Bus 128-bit | Memory Bus 256-bit |
Memory Speed 18GT/s | Memory Speed 6.8GT/s |
Memory Bandwidth 288GB/s | Memory Bandwidth 218.9GB/s |
ECC No | ECC No |
TDP 130W | TDP 185W |
Max Temp - | Max Temp 100°C Max |
Multi-Monitor 3 | Multi-Monitor 6 |
HDCP HDCP 2.3 | HDCP HDCP 2.2 |
4x DisplayPort 2.1 | - |
- | 2x HDMI 2.0 |
Encoder Model VCN 4.0 | Encoder Model VCE 3.4 |
Decoder Model VCN 4.0 | Decoder Model UVD 6.3 |
Form Factor PCIe Card | Form Factor MPX |
PCIe 1-Slots | PCIe 2-Slots |
Height 115 mm (4.53")Width 241 mm (9.49")Depth 20 mm (0.79") | - |
Cooling Blower 1x Fan | Cooling Passive - |
Power Connectors 1x 8-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hotpink Bonefish | Codename Ellesmere |
Chip Variant Navi 33 XL | Chip Variant Polaris 20 XL |
Market Segment Workstation | Market Segment Workstation |
Release Date Aug 3, 2023 | Release Date Dec 11, 2019 |
Foundry TSMC | Foundry GlobalFoundries |
Fabrication Node N6 | Fabrication Node 14LPP |
Die Size 204mm² | Die Size 232mm² |
Transistor Count 13.3 Billion | Transistor Count 5.7 Billion |
Transistor Density 65.2 MTr/mm² | Transistor Density 24.57 MTr/mm² |
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Desktops - | Desktops |