AMD Radeon PRO W7600 vs Intel Arc Pro A60 Full Specs
2,048 Shaders 2.44GHz | 2,048 Shaders 2.05GHz |
8GB GDDR6288GB/s | 12GB GDDR6384GB/s |
·· 19.99 TFLOPS | ·· 8.4 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 130W | TDP 130W |
Power Connectors 1x 8-Pin | Power Connectors - |
Radeon PRO W760079.95 TOPSINT4 Tensor
Arc Pro A60268.7 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 79.95 TOPSINT4 Tensor | Peak OPS 268.7 TOPSINT4 Tensor |
Tensor FP16-16 19.99 TFLOPSTensor FP16-32 19.99 TFLOPS | Tensor FP16-16 -Tensor FP16-32 67.17 TFLOPS |
BF16 39.98 TFLOPSTensor BF16 19.99 TFLOPS | BF16 -Tensor BF16 67.17 TFLOPS |
FP32 19.99 TFLOPS | FP32 8.4 TFLOPS |
FP64 624.6 GFLOPS | FP64 2.1 TFLOPS |
Tensor INT4 79.95 TOPS | Tensor INT4 268.7 TOPS |
Tensor INT8 19.99 TOPS | Tensor INT8 134.3 TOPS |
Pixel Rate 156.2 GPixel/s | Pixel Rate 131.2 GPixel/s |
Texture Rate 312.3 GTexel/s | Texture Rate 262.4 GTexel/s |
Shaders 2,048 Shaders | Shaders 2,048 Shaders |
TMUs 128 TMUs | TMUs 128 TMUs |
ROPs 64 ROPs | ROPs 64 ROPs |
Tensor Cores 64 T-Cores | Tensor Cores 256 T-Cores |
RT Cores 32 RT-Cores | RT Cores 16 RT-Cores |
CUs 32 CUs | EUs 256 EUs |
Base Clock 1.72GHz | Base Clock 900MHz |
Boost Clock 2.44GHz | Boost Clock 2.05GHz |
L2 Cache 2MB shared | L2 Cache 8.2MB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.17TB/s | L3 Bandwidth - |
8GB GDDR6 | 12GB GDDR6 |
Memory Bus 128-bit | Memory Bus 192-bit |
Memory Speed 18GT/s | Memory Speed 16GT/s |
Memory Bandwidth 288GB/s | Memory Bandwidth 384GB/s |
TDP 130W | TDP 130W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
4x DisplayPort 2.1 | - |
- | 4x Mini DisplayPort 2.0 |
Encoder Model VCN 4.0 | Encoder Model Arc |
Decoder Model VCN 4.0 | Decoder Model Arc |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 2-Slots |
Height 115 mm (4.53")Width 241 mm (9.49")Depth 20 mm (0.79") | - |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Power Connectors 1x 8-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hotpink Bonefish | Codename Xe HPG |
Chip Variant Navi 33 XL | Chip Variant DG2-256 |
Market Segment Workstation | Market Segment Workstation |
Release Date Aug 3, 2023 | Release Date Jun 6, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node N6 |
Die Size 204mm² | Die Size 269mm² |
Transistor Count 13.3 Billion | Transistor Count 11.5 Billion |
Transistor Density 65.2 MTr/mm² | Transistor Density 42.75 MTr/mm² |
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