AMD Radeon PRO W7600 vs Intel Arc Pro B60 Full Specs
2,048 Shaders 2.44GHz | 2,560 Shaders 2.4GHz |
8GB GDDR6288GB/s | 24GB GDDR6456GB/s |
·· 19.99 TFLOPS | ·· 12.29 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 130W | TDP 200W |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Radeon PRO W760079.95 TOPSINT4 Tensor
Arc Pro B60393.2 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 79.95 TOPSINT4 Tensor | Peak OPS 393.2 TOPSINT4 Tensor |
Tensor FP16-16 19.99 TFLOPSTensor FP16-32 19.99 TFLOPS | Tensor FP16-16 -Tensor FP16-32 98.3 TFLOPS |
BF16 39.98 TFLOPSTensor BF16 19.99 TFLOPS | BF16 -Tensor BF16 98.3 TFLOPS |
FP32 19.99 TFLOPS | FP32 12.29 TFLOPS |
FP64 624.6 GFLOPS | FP64 3.07 TFLOPS |
Tensor INT4 79.95 TOPS | Tensor INT4 393.2 TOPS |
Tensor INT8 19.99 TOPS | Tensor INT8 196.6 TOPS |
Pixel Rate 156.2 GPixel/s | Pixel Rate 192 GPixel/s |
Texture Rate 312.3 GTexel/s | Texture Rate 384 GTexel/s |
Shaders 2,048 Shaders | Shaders 2,560 Shaders |
TMUs 128 TMUs | TMUs 160 TMUs |
ROPs 64 ROPs | ROPs 80 ROPs |
Tensor Cores 64 T-Cores | Tensor Cores 160 T-Cores |
RT Cores 32 RT-Cores | RT Cores 20 RT-Cores |
CUs 32 CUs | EUs 160 EUs |
Base Clock 1.72GHz | Base Clock 2GHz |
Boost Clock 2.44GHz | Boost Clock 2.4GHz |
L2 Cache 2MB shared | L2 Cache 18.4MB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.17TB/s | L3 Bandwidth - |
8GB GDDR6 | 24GB GDDR6 |
Memory Bus 128-bit | Memory Bus 192-bit |
Memory Speed 18GT/s | Memory Speed 19GT/s |
Memory Bandwidth 288GB/s | Memory Bandwidth 456GB/s |
TDP 130W | TDP 200W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
4x DisplayPort 2.1 | - |
- | 4x Mini DisplayPort 2.1 |
Encoder Model VCN 4.0 | Encoder Model Arc |
Decoder Model VCN 4.0 | Decoder Model Arc |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 2-Slots |
Height 115 mm (4.53")Width 241 mm (9.49")Depth 20 mm (0.79") | Height 111 mm (4.37")Width 222 mm (8.74")Depth 40 mm (1.57") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hotpink Bonefish | Codename Xe2 HPG |
Chip Variant Navi 33 XL | Chip Variant - |
Market Segment Workstation | Market Segment Workstation |
Release Date Aug 3, 2023 | Release Date May 19, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node N5 |
Die Size 204mm² | Die Size 272mm² |
Transistor Count 13.3 Billion | Transistor Count 19.6 Billion |
Transistor Density 65.2 MTr/mm² | Transistor Density 72.06 MTr/mm² |
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