GPUs

AMD Radeon PRO W7700 vs ATI FirePro 3D V8800 Full Specs

3,072 Shaders
2.6GHz
1,600 Shaders
825MHz
16GB GDDR6576GB/s
2GB GDDR5147.2GB/s
··
31.95 TFLOPS
··
2.64 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
190W
TDP
208W
Power Connectors
1x 8-Pin
-
Power Connectors
-
2x 6-Pin

Radeon PRO W7700Radeon PRO W7700127.8 TOPSINT4 Tensor
x48.41
FirePro 3D V8800FirePro 3D V88002.64 TFLOPSFP32
x1

Clock Speed
···
Clock Speed
··
Peak OPS
127.8 TOPSINT4 Tensor
Peak OPS
2.64 TFLOPSFP32
Tensor FP16-16
31.95 TFLOPS
Tensor FP16-32
31.95 TFLOPS
-
BF16
63.9 TFLOPS
Tensor BF16
31.95 TFLOPS
-
FP32
31.95 TFLOPS
FP32
2.64 TFLOPS
FP64
998.4 GFLOPS
FP64
528 GFLOPS
Tensor INT4
127.8 TOPS
Tensor INT4
-
Tensor INT8
31.95 TOPS
-
Pixel Rate
249.6 GPixel/s
Pixel Rate
26.4 GPixel/s
Texture Rate
499.2 GTexel/s
Texture Rate
66 GTexel/s

Shaders
3,072 Shaders
Shaders
1,600 Shaders
TMUs
192 TMUs
TMUs
80 TMUs
ROPs
96 ROPs
ROPs
32 ROPs
Tensor Cores
96 T-Cores
Tensor Cores
-
RT Cores
48 RT-Cores
RT Cores
-
CUs
48 CUs
CUs
20 CUs

Base Clock
1.9GHz
Base Clock
-
Boost Clock
2.6GHz
Boost Clock
825MHz

L2 Cache
6.1MB shared
L2 Cache
512KB shared
L3 Cache
64MB shared
L3 Cache
-
L3 Bandwidth
2.33TB/s
L3 Bandwidth
-

16GB GDDR6
2GB GDDR5
Memory Bus
256-bit
Memory Bus
256-bit
Memory Speed
18GT/s
Memory Speed
4.6GT/s
Memory Bandwidth
576GB/s
Memory Bandwidth
147.2GB/s
ECC
No
ECC
No

TDP
190W
TDP
208W

Multi-Monitor
3
Multi-Monitor
4
HDCP
HDCP 2.3
HDCP
-

4x DisplayPort 2.1
-
-
4x DisplayPort 1.1
-
1x S-Video

Encoder Model
VCN 4.0
-

Decoder Model
VCN 4.0
Decoder Model
UVD 2.2

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
2-Slots
Height
111 mm (4.37")
Width
241 mm (9.49")
Depth
40 mm (1.57")
Height
111 mm (4.37")
Width
267 mm (10.51")
Depth
37 mm (1.46")
Cooling
Blower
1x Fan
Cooling
Blower
1x Fan
Power Connectors
1x 8-Pin
Power Connectors
2x 6-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2023 branding
Branding
FirePro branding
Codename
Wheat Nas
Codename
Cypress
Chip Variant
Navi 32
Chip Variant
Cypress LE
Market Segment
Workstation
Market Segment
Workstation
Release Date
Nov 13, 2023
Release Date
Apr 7, 2010

Foundry
TSMC
Foundry
TSMC
Other Foundries
TSMCMCD
Other Foundries
-
Fabrication Node
N5
N6MCD
Fabrication Node
40nm
-
Die Size
200mm²
150mm²MCD
Die Size
334mm²
-
Transistor Count
28.1 Billion
8.2 BillionMCD
Transistor Count
2.2 Billion
-
Transistor Density
140.5 MTr/mm²
54.67 MTr/mm²MCD
Transistor Density
6.45 MTr/mm²
-

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