ATI FirePro 3D V8800 vs AMD Radeon PRO W7500 Full Specs
1,600 Shaders 825MHz | 1,792 Shaders 1.7GHz |
2GB GDDR5147.2GB/s | 8GB GDDR6172GB/s |
·· 2.64 TFLOPS | ·· 12.19 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 208W | TDP 70W |
Power Connectors 2x 6-Pin | Power Connectors - |
FirePro 3D V88002.64 TFLOPSFP32
Radeon PRO W750048.74 TOPSINT4 TensorClock Speed ·· | Clock Speed ··· |
Peak OPS 2.64 TFLOPSFP32 | Peak OPS 48.74 TOPSINT4 Tensor |
- | Tensor FP16-16 12.19 TFLOPSTensor FP16-32 12.19 TFLOPS |
- | BF16 24.37 TFLOPSTensor BF16 12.19 TFLOPS |
FP32 2.64 TFLOPS | FP32 12.19 TFLOPS |
FP64 528 GFLOPS | FP64 380.8 GFLOPS |
Tensor INT4 - | Tensor INT4 48.74 TOPS |
- | Tensor INT8 12.19 TOPS |
Pixel Rate 26.4 GPixel/s | Pixel Rate 108.8 GPixel/s |
Texture Rate 66 GTexel/s | Texture Rate 190.4 GTexel/s |
Shaders 1,600 Shaders | Shaders 1,792 Shaders |
TMUs 80 TMUs | TMUs 112 TMUs |
ROPs 32 ROPs | ROPs 64 ROPs |
Tensor Cores - | Tensor Cores 56 T-Cores |
RT Cores - | RT Cores 28 RT-Cores |
CUs 20 CUs | CUs 28 CUs |
Base Clock - | Base Clock 1.5GHz |
Boost Clock 825MHz | Boost Clock 1.7GHz |
L2 Cache 512KB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.17TB/s |
2GB GDDR5 | 8GB GDDR6 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 4.6GT/s | Memory Speed 10.8GT/s |
Memory Bandwidth 147.2GB/s | Memory Bandwidth 172GB/s |
TDP 208W | TDP 70W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 4x DisplayPort 2.1 |
4x DisplayPort 1.1 | - |
1x S-Video | - |
- | Encoder Model VCN 4.0 |
Decoder Model UVD 2.2 | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 1-Slots |
Height 111 mm (4.37")Width 267 mm (10.51")Depth 37 mm (1.46") | Height 115 mm (4.53")Width 216 mm (8.5")Depth 20 mm (0.79") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Power Connectors 2x 6-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Cypress | Codename Hotpink Bonefish |
Chip Variant Cypress LE | Chip Variant Navi 33 XL |
Market Segment Workstation | Market Segment Workstation |
Release Date Apr 7, 2010 | Release Date Aug 3, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 40nm | Fabrication Node N6 |
Die Size 334mm² | Die Size 204mm² |
Transistor Count 2.2 Billion | Transistor Count 13.3 Billion |
Transistor Density 6.45 MTr/mm² | Transistor Density 65.2 MTr/mm² |
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