GPUs

AMD Radeon PRO W7700 vs Intel Arc A770M Full Specs

3,072 Shaders
2.6GHz
4,096 Shaders
1.65GHz
16GB GDDR6576GB/s
16GB GDDR6512GB/s
··
31.95 TFLOPS
··
13.52 TFLOPS
Form Factor
PCIe Card
Form Factor
Soldered
TDP
190W
TDP
120W
Power Connectors
1x 8-Pin
Power Connectors
-

Radeon PRO W7700Radeon PRO W7700127.8 TOPSINT4 Tensor
x1
Arc A770MArc A770M432.5 TOPSINT4 Tensor
x3.38

Clock Speed
···
Clock Speed
···
Peak OPS
127.8 TOPSINT4 Tensor
Peak OPS
432.5 TOPSINT4 Tensor
Tensor FP16-16
31.95 TFLOPS
Tensor FP16-32
31.95 TFLOPS
Tensor FP16-16
-
Tensor FP16-32
108.1 TFLOPS
BF16
63.9 TFLOPS
Tensor BF16
31.95 TFLOPS
BF16
-
Tensor BF16
108.1 TFLOPS
FP32
31.95 TFLOPS
FP32
13.52 TFLOPS
FP64
998.4 GFLOPS
FP64
3.38 TFLOPS
Tensor INT4
127.8 TOPS
Tensor INT4
432.5 TOPS
Tensor INT8
31.95 TOPS
Tensor INT8
216.3 TOPS
Pixel Rate
249.6 GPixel/s
Pixel Rate
211.2 GPixel/s
Texture Rate
499.2 GTexel/s
Texture Rate
422.4 GTexel/s

Shaders
3,072 Shaders
Shaders
4,096 Shaders
TMUs
192 TMUs
TMUs
256 TMUs
ROPs
96 ROPs
ROPs
128 ROPs
Tensor Cores
96 T-Cores
Tensor Cores
512 T-Cores
RT Cores
48 RT-Cores
RT Cores
32 RT-Cores
CUs
48 CUs
EUs
512 EUs

Base Clock
1.9GHz
Base Clock
300MHz
Boost Clock
2.6GHz
Boost Clock
1.65GHz

L2 Cache
6.1MB shared
L2 Cache
8.2MB shared
L3 Cache
64MB shared
L3 Cache
-
L3 Bandwidth
2.33TB/s
L3 Bandwidth
-

16GB GDDR6
16GB GDDR6
Memory Bus
256-bit
Memory Bus
256-bit
Memory Speed
18GT/s
Memory Speed
16GT/s
Memory Bandwidth
576GB/s
Memory Bandwidth
512GB/s
ECC
No
ECC
No

TDP
190W
TDP
120W

Multi-Monitor
3
Multi-Monitor
4
HDCP
HDCP 2.3
HDCP
-

4x DisplayPort 2.1
-

Encoder Model
VCN 4.0
Encoder Model
Arc

Decoder Model
VCN 4.0
Decoder Model
Arc

Form Factor
PCIe Card
Form Factor
Soldered
PCIe
2-Slots
PCIe
-
Height
111 mm (4.37")
Width
241 mm (9.49")
Depth
40 mm (1.57")
-
Cooling
Blower
1x Fan
Cooling
Open-Air
-
Power Connectors
1x 8-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2023 branding
Branding
Arc branding
Codename
Wheat Nas
Codename
Xe HPG
Chip Variant
Navi 32
Chip Variant
DG2-512
Market Segment
Workstation
Market Segment
Laptop
Release Date
Nov 13, 2023
Release Date
Jun 28, 2022

Foundry
TSMC
Foundry
TSMC
Other Foundries
TSMCMCD
Other Foundries
-
Fabrication Node
N5
N6MCD
Fabrication Node
N6
-
Die Size
200mm²
150mm²MCD
Die Size
406mm²
-
Transistor Count
28.1 Billion
8.2 BillionMCD
Transistor Count
21.7 Billion
-
Transistor Density
140.5 MTr/mm²
54.67 MTr/mm²MCD
Transistor Density
53.45 MTr/mm²
-

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