AMD Radeon Pro WX 3100M vs Intel Arc A770 Full Specs

Summary

512 Shaders 1.22GHz	4,096 Shaders 2.4GHz
4GB GDDR596GB/s	8GB GDDR6512GB/s
Peak·FP32·FP16 1.25 TFLOPS	Peak·FP32·FP16 19.66 TFLOPS
Form Factor Soldered	Form Factor PCIe Card
TDP 50W	TDP 225W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Radeon Pro WX 3100M1.25 TFLOPSFP16

x1

Arc A770629.1 TOPSINT4 Tensor

x504.02

Show Top Score

Theoretical Performance

Clock Speed1219MHz UC·Base·Boost·OC	Clock Speed2400MHz UC·Base·Boost·OC
Peak OPS 1.25 TFLOPSFP16	Peak OPS 629.1 TOPSINT4 Tensor
-	Tensor FP16-32 157.3 TFLOPS
-	Tensor BF16 157.3 TFLOPS
FP32 1.25 TFLOPS	FP32 19.66 TFLOPS
FP64 78.02 GFLOPS	FP64 4.92 TFLOPS
Tensor INT4 -	Tensor INT4 629.1 TOPS
-	Tensor INT8 314.6 TOPS
Pixel Rate 19.5 GPixel/s	Pixel Rate 307.2 GPixel/s
Texture Rate 39 GTexel/s	Texture Rate 614.4 GTexel/s

Core Config

Shaders 512 Shaders	Shaders 4,096 Shaders
TMUs 32 TMUs	TMUs 256 TMUs
ROPs 16 ROPs	ROPs 128 ROPs
Tensor Cores -	Tensor Cores 512 T-Cores
RT Cores -	RT Cores 32 RT-Cores
CUs 8 CUs	EUs 512 EUs

Clocks

Base Clock 925MHz	Base Clock 2.1GHz
Boost Clock 1.22GHz	Boost Clock 2.4GHz

Cache

L2 Cache 512KB shared

L2 Cache 8.2MB shared

Memory

4GB GDDR5	8GB GDDR6
Memory Bus 128-bit	Memory Bus 256-bit
Memory Speed 6GT/s	Memory Speed 16GT/s
Memory Bandwidth 96GB/s	Memory Bandwidth 512GB/s

Power & Thermals

TDP 50W

TDP 225W

Video Output

Multi-Monitor 3	Multi-Monitor 4
HDCP HDCP 2.2	HDCP -

Ports

-	3x DisplayPort 2.0
-	1x HDMI 2.1

Encoder

Encoder Model VCE 3.4

Encoder Model Arc

Decoder

Decoder Model UVD 6.3

Decoder Model Arc

Card

Form Factor Soldered	Form Factor PCIe Card
PCIe -	PCIe 2-Slots
-	Height 98.4 mm (3.87") Width 279.9 mm (11.02") Depth 40 mm (1.57")
Cooling Open-Air -	Cooling Open-Air 2x Fans

Chip

Manufacturer AMD	Manufacturer Intel
Chip Designer AMD	Chip Designer Intel
Architecture GCN 4	Architecture Alchemist
Family Radeon Pro WX	Family Arc A
Branding	Branding
Codename Lexa	Codename Xe HPG
Chip Variant Polaris 12 XL	Chip Variant DG2-512
Market Segment Laptop	Market Segment Desktop
Release Date Mar 1, 2017	Release Date Oct 14, 2022

Fabrication

Foundry GlobalFoundries	Foundry TSMC
Fabrication Node 14LPP	Fabrication Node N6
Die Size 103mm²	Die Size 406mm²
Transistor Count 2.2 Billion	Transistor Count 21.7 Billion
Transistor Density 21.36 MTr/mm²	Transistor Density 53.45 MTr/mm²

Images

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Competitors

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